Piezoelectric substrate attachment structure, sensor module, moving body, and protection body

ABSTRACT

A piezoelectric substrate attachment structure including a press section pressed by contact, a piezoelectric substrate provided adjacent to the press section, and a base section provided adjacent to the piezoelectric substrate on an opposite side from the press section. The following relationship Equation (a) is satisfied:
 
 da/E′a&lt;db/E′b   (a)
         wherein da is a thickness of the press section in a direction of adjacency to the piezoelectric substrate, E′a is a storage modulus of the press section from dynamic viscoelastic analysis, db is a thickness of the base section in the adjacency direction, and E′b is a storage modulus of the base section from dynamic viscoelastic analysis.

TECHNICAL FIELD

The present invention relates to a piezoelectric substrate attachment structure, a sensor module, a moving body, and a protection body.

BACKGROUND ART

There have recently been trials utilizing a material having piezoelectric properties covering a conductor.

For example, known piezoelectric cables include configurations having a central conductor, a piezoelectric material layer, an outer conductor, and a sheath arranged coaxially to each other in this sequence from the center to the outside (see, for example, Patent Documents 1 and 2). In the piezoelectric cables of Patent Documents 1 and 2, it is the piezoelectric cables themselves that configure pressure detection devices.

However, pressure detection devices incorporating piezoelectric cables as sensors are also being produced. For example, Patent Document 3 discloses a bed device capable of detecting a human body in which a piezoelectric cable arranged in a wavy shape is incorporated into a mattress. Moreover, for example, Patent Document 4 discloses an intruder alarm device in which a piezoelectric cable arranged in a wavy shape is incorporated within a sensor mat having a waterproof and dustproof configuration made from a urethane rubber.

Patent Document 1: Japanese Patent Application Laid-Open (JP-A) No. H10-132669

Patent Document 2: JP-A No. 2010-071840

Patent Document 3: JP-A No. 2005-351781

Patent Document 4: JP-A No. 2008-146528

SUMMARY OF INVENTION Technical Problem

However, in cases in which a pressure detection device incorporating a piezoelectric cable as a sensor is employed on a moving body such as a vehicle or trolley, a problem occurs in that shock during movement of the moving body is detected in the piezoelectric cable. Specifically, for example, in cases in which such a pressure detection device is used as a contact sensor employed to stop a trolley in an emergency, sometimes a large shock arises during travel, such as when mounting a step or the like, leading to a large response in the piezoelectric cable. In such cases, the more the sensitivity to contact with people and objects is raised, the greater the influence of shock and vibration during travel. Namely, a problem arises in that the pressure imparted from outside that you are striving to detect becomes indistinguishable from the noise of shock and vibration generated on the trolley side.

An object of one aspect in the invention is to provide a piezoelectric substrate attachment structure, a sensor module, a moving body, and a protection body in which shock and vibration is not prone to be transmitted from the mounting target side, and in which pressure imparted from outside is readily transmitted.

Solution to Problem

Specific means to solve the problem are as follows.

<1> A piezoelectric substrate attachment structure including a press section pressed by contact, a piezoelectric substrate provided adjacent to the press section, and a base section provided adjacent to the piezoelectric substrate on an opposite side from the press section. The piezoelectric substrate attachment structure is configured such that the following relationship Equation (a) is satisfied: da/E′a<db/E′b  (a)

wherein da is a thickness of the press section in a direction of adjacency to the piezoelectric substrate, E′a is a storage modulus of the press section from dynamic viscoelastic analysis, db is a thickness of the base section in the adjacency direction, and E′b is a storage modulus of the base section from dynamic viscoelastic analysis.

<2> The piezoelectric substrate attachment structure of <1>, wherein the thickness da is in a range of from 0.005 to 50 mm, and the thickness db is in a range of from 0.005 to 100 mm.

<3> The piezoelectric substrate attachment structure of <1> or <2>, wherein the storage modulus E′a is in a range of from 1×10⁵ to 1×10¹² Pa, and the storage modulus E′b is in a range of from 1×10⁴ to 1×10¹⁰ Pa.

<4> The piezoelectric substrate attachment structure of any one of <1> to <3>, wherein the piezoelectric substrate includes an elongate shaped conductor and an elongate shaped piezoelectric material helically wound around the conductor in one direction, and the piezoelectric material is a body formed from an organic piezoelectric material. <5> The piezoelectric substrate attachment structure of <4>, wherein the organic piezoelectric material includes polylactic acid. <6> The piezoelectric substrate attachment structure of any one of <1> to <5>, wherein the press section, the piezoelectric substrate, and the base section are arranged in this sequence along a direction of pressure-application to the press section. <7> The piezoelectric substrate attachment structure of any one of <1> to <6>, wherein the piezoelectric substrate is provided such that an axial direction of the piezoelectric substrate lies in a direction intersecting a direction of pressure-application. <8> The piezoelectric substrate attachment structure of any one of <1> to <7>, wherein axial direction movement of the piezoelectric substrate is restricted with respect to at least one of the press section or the base section. <9> The piezoelectric substrate attachment structure of any one of <1> to <8>, wherein the press section is an insulator covering an outer periphery of the piezoelectric substrate adjacent to the base section. <10> A sensor module including the piezoelectric substrate attachment structure of any one of any one of <1> to <9>. <11> The sensor module of <10>, including a main body configured by an integrated unit of the press section and the base section. <12> A moving body including a shock absorbing member on at least a moving direction side of the moving body, and the piezoelectric substrate attachment structure of any one of <1> to <9>. The shock absorbing member configures the base section, and the press section and the piezoelectric substrate of the attachment structure are mounted to the shock absorbing member. <13> A moving body having the base section of the sensor module according to <10> or <11> attached to a moving direction side of the moving body. <14> A protection body including a contact member at a contact portion where the protection body makes external contact, and the piezoelectric substrate attachment structure of any one of <1> to <9>. The contact member configures the base section, and the press section and the piezoelectric substrate of the attachment structure are mounted to the contact member. <15> A protection body in which the sensor module of <10> or <11> is formed so as to conform to a shape of an object to be protected.

Advantageous Effects

An aspect in the invention enables a piezoelectric substrate attachment structure, a sensor module, a moving body, and a protection body to be provided in which shock and vibration are not prone to be transmitted from a mounting target side, and in which pressure is readily transmitted from outside.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1A is a perspective view of a sensor module of a first embodiment.

FIG. 1B is a plan view cross-section of the sensor module of the first embodiment.

FIG. 1C is a side view cross-section of the sensor module of the first embodiment.

FIG. 2A is a side view illustrating a specific aspect A of a piezoelectric substrate according to the first embodiment.

FIG. 2B is a cross-section taken along line X-X′ of FIG. 2A.

FIG. 3 is a side view illustrating a specific aspect B of the piezoelectric substrate according to the first embodiment.

FIG. 4 is a side view illustrating a specific aspect C of the piezoelectric substrate according to the first embodiment.

FIG. 5A is a perspective view of a sensor module according to a second embodiment.

FIG. 5B is a plan view cross-section of the sensor module of the second embodiment.

FIG. 5C is a side view cross-section of the sensor module of the second embodiment.

FIG. 6A is a perspective view of a sensor module of a third embodiment.

FIG. 6B is a plan view cross-section of a sensor module of the third embodiment.

FIG. 6C is a side view cross-section of the sensor module of the third embodiment.

FIG. 7A is a perspective view of a sensor module of a fourth embodiment.

FIG. 7B is a plan view cross-section of the sensor module of the fourth embodiment.

FIG. 7C is a side view cross-section of the sensor module of the fourth embodiment.

FIG. 8A is a perspective view of a sensor module of a fifth embodiment.

FIG. 8B is a plan view cross-section of the sensor module of the fifth embodiment.

FIG. 8C is a side view cross-section of the sensor module of the fifth embodiment.

FIG. 9A is a perspective view of a sensor module of a sixth embodiment.

FIG. 9B is a plan view cross-section of the sensor module of the sixth embodiment.

FIG. 9C is a side view cross-section of the sensor module of the sixth embodiment.

FIG. 10A is a plan view to explain a layout method of a piezoelectric substrate of a seventh embodiment.

FIG. 10B is a plan view to explain a layout method of a piezoelectric substrate of an eighth embodiment.

FIG. 10C is a plan view to explain a layout method of piezoelectric substrates of a ninth embodiment.

FIG. 11A is an explanatory diagram for a specific aspect A of a moving body.

FIG. 11B is an explanatory diagram for a specific aspect B of a moving body.

FIG. 12A is an explanatory diagram for a specific aspect A of a protection body.

FIG. 12B is an explanatory diagram for a specific aspect B of a protection body.

FIG. 13 is a face-on view of a testing device related to sensitivity measurement of Example 1 and Comparative Example 1.

FIG. 14A is a diagram illustrating an output signal when shock is applied in sensitivity measurement, and is a graph illustrating results for Example 1.

FIG. 14B is a diagram illustrating an output signal when shock is applied in sensitivity measurement, and is a graph illustrating results for Comparative Example 1.

FIG. 15A is an exploded perspective view of Example 2.

FIG. 15B is a perspective view of Example 2.

DESCRIPTION OF EMBODIMENTS

Embodiments in the invention will be described below. The invention is not limited to the following embodiments.

Herein, a numerical range represented by “from A to B” means a range including numerical values A and B as a lower limit value and an upper limit value, respectively.

Herein, “principal faces” of each of elongate-flat-plate-shaped piezoelectric materials (a first piezoelectric material and a second piezoelectric material) means faces perpendicular to the thickness direction of the elongate-flat-plate-shaped piezoelectric material (i.e., is faces including a lengthwise direction and a width direction thereof).

Herein, a “face” of a member means a “principal face” of the member unless otherwise specified.

Herein, a thickness, a width, and a length satisfy a relationship of thickness<width<length, as in the usual definitions thereof.

Herein, “adhesion” is a concept including “pressure sensitive adhesion”. “Adhesive layer” is a concept including “pressure sensitive adhesive layer”.

Herein, an angle formed between two line segments is expressed in a range of from 0° to 90°.

Herein, “film” is a concept including so-called “sheets” as well as so-called “films”.

Herein, “MID” means a flow direction (machine direction) of a film.

First Embodiment

As a first embodiment, description follows of a piezoelectric substrate attachment structure (referred to below simply as “attachment structure 100”) and a sensor module 200 equipped with the attachment structure 100, with reference to FIG. 1A to FIG. 4 .

(Outline of Attachment Structure)

The attachment structure 100 according to the present embodiment includes a press section 20A pressed by contact, a piezoelectric substrate 10 provided adjacent to the press section 20A, and a base section 20B provided adjacent to the piezoelectric substrate 10 on the opposite side from the press section 20A.

A pressure-applied face 21 is formed on a face on the opposite side of the press section 20A from the face contacting the piezoelectric substrate 10. The pressure-applied face 21 is a face pressed by contact, and functions as a measurement face to measure pressure. The base section 20B on the side opposite from the press section 20A, with the piezoelectric substrate 10 interposed therebetween, functions as a fixing member to fix the sensor module 200 to a mounting target.

As illustrated in FIG. 1C, in the present embodiment, the press section 20A, the piezoelectric substrate 10, and the base section 20B are arranged along a pressure-application direction of pressure borne by the pressure-applied face 21 (an arrow P direction). The piezoelectric substrate 10 is provided with its axial direction in a direction intersecting with the pressure-application direction (i.e. in the straight line C direction).

The attachment structure 100 of the present embodiment is configured such that the following relationship Equation (a) is satisfied: da/E′a<db/E′b  (a)

wherein da is a thickness of the press section 20A in a direction of adjacency to the piezoelectric substrate 10, E′a is a storage modulus of the press section 20A from dynamic viscoelastic analysis, db is a thickness of the base section 20B in the adjacency direction, and E′b is a storage modulus of the base section 20B from dynamic viscoelastic analysis.

The inventors have discovered that, by increasing a difference between shock and vibration imparted to the base section 20B and pressure imparted to the press section 20A, the pressure imparted to the press section 20A can be selectively detected, when the range of Equation (a) is satisfied for the relationship between a ratio of the thickness da of the press section 20A in the direction of adjacency to the piezoelectric substrate 10, to the storage modulus E′a from dynamic viscoelastic analysis of the press section 20A, and a ratio of the thickness db of the base section 20B in the adjacency direction, to the storage modulus E′b from dynamic viscoelastic analysis of the base section 20B.

The larger the value of the storage modulus E′ is, the harder a material is referred to as being, and the smaller the value thereof is, the softer a material is referred to as being. Thus, if the press section 20A and the base section 20B are each formed from the same substance, then a configuration in which shock and vibration are not prone to be transmitted from the base section 20B side, while enabling pressure to be readily transmitted from the press section 20A, can be achieved by making the thickness db of the base section 20B thicker than the thickness da of the press section 20A. In the present embodiment, the thickness da of the press section 20A is preferably in a range of from 0.005 to 50 mm, and the thickness db of the base section 20B is preferably in a range of from 0.005 to 100 mm.

If the thicknesses of the press section 20A and the base section 20B are the same as each other, then making the value of the storage modulus E′b of the base section 20B smaller than the storage modulus E′a of the press section 20A achieves a configuration in which shock and vibration are not prone to be transmitted from the base section 20B side, and pressure is readily transmitted from the press section 20A. Namely, employing a softer material for the base section 20B than for the press section 20A, makes shock and vibration not prone to be transmitted from the base section 20B side, while enabling pressure to be readily transmitted from the press section 20A. In the present embodiment, the storage modulus E′a of the press section 20A is preferably in a range of from 1×10⁵ to 1×10¹² Pa, and the storage modulus E′b of the base section 20B is preferably in a range of from 1×10⁴ to 1×10¹⁰ Pa.

Thus, by adjusting such that the thicknesses d and storage moduli E′ of the press section 20A and the base section 20B are in the range of Equation (a), the selective detection of pressure imparted to the press section 20A is enabled. Namely, in the piezoelectric substrate 10 of the attachment structure 100 of the present embodiment, shock and vibration imparted to the base section 20B are not prone to be transmitted, and pressure imparted to the press section 20A is readily transmitted.

(Sensor Module)

Next, a sensor module 200 equipped with the attachment structure 100 of the present embodiment will be described below.

FIG. 1A is a perspective view of the sensor module 200 of the present embodiment. The sensor module 200 of the present embodiment has a cuboidal external appearance, and includes a first member 220 and a second member 222 for placing the first member 220 on. In the present embodiment, the first member 220 corresponds to the press section 20A, and the second member 222 corresponds to the base section 20B.

FIG. 1B is a plan view cross-section (cross-section along a plane parallel to a principal face) of the sensor module 200 sectioned along a boundary at the axis of the piezoelectric substrate 10 (straight line C), and is a cross-section taken along line P1-P1′ of FIG. 1A. As illustrated in FIG. 1B, the piezoelectric substrate 10 is a cable-shaped piezoelectric substrate 10 extending in a straight line from one end to the other end in a lengthwise direction.

FIG. 1C is a side view cross-section (cross-section taken along the thickness direction) of the sensor module 200 sectioned along a boundary at the axis of the piezoelectric substrate 10 (straight line C), and is a cross-section taken along line S1-S1′ of FIG. 1A. As illustrated in this figure, the sensor module 200 of the present embodiment is formed by sandwiching the cable-shaped piezoelectric substrate 10 between the first member 220 and the second member 222.

The following materials may be employed as the first member 220.

Materials that may be employed therefor include: an organic gel; an inorganic gel; an elastomer such as a silicone elastomer, an acrylic elastomer, a urethane elastomer, a fluorine-based elastomer, a perfluoro elastomer, an isoprene rubber, a butadiene rubber, a styrene-butadiene rubber, natural rubber, a chloroprene rubber, a nitrile rubber, a butyl rubber, an ethylene propylene rubber, and an epichlorohydrin rubber; a polymer material such as polyethylene, polypropylene, polystyrene, polyvinylchloride, polyethylene terephthalate, a polycarbonate, polyamide, a polyvinyl alcohol, polyacetal, a polyimide, polyester, a cyclic polyolefin, a styrene-acrylonitrile copolymer, a styrene-butadiene-acrylonitrile copolymer, an ethylene-vinyl acetate copolymer, a methacrylic-styrene copolymer, an acrylic resin, a fluororesin, a urethane resin, a phenol resin, a urea resin, an epoxy resin, a cellulose-based resin, an unsaturated polyester resin, a melamine resin, a silicone resin, a copolymer or alloy thereof, a modified product thereof, and a foamed product (foam) thereof; a metal material such as aluminum, iron, steel, copper, nickel, cobalt, titanium, magnesium, tin, zinc, lead, gold, silver, platinum, or an alloy thereof; timber; glass; and the like.

A layered body configured from plural of the above materials may also be employed.

The following materials may be employed as the second member 222.

Materials that may be employed therefor include: an organic gel; an inorganic gel; an elastomer such as a silicone elastomer, an acrylic elastomer, a urethane elastomer, a fluorine-based elastomer, a perfluoro elastomer, an isoprene rubber, a butadiene rubber, a styrene-butadiene rubber, natural rubber, a chloroprene rubber, a nitrile rubber, a butyl rubber, an ethylene propylene rubber, and an epichlorohydrin rubber; a polymer material such as polyethylene, polypropylene, polystyrene, polyvinylchloride, polyethylene terephthalate, a polycarbonate, polyamide, a polyvinyl alcohol, polyacetal, a polyimide, polyester, a cyclic polyolefin, a styrene-acrylonitrile copolymer, a styrene-butadiene-acrylonitrile copolymer, an ethylene-vinyl acetate copolymer, a methacrylic-styrene copolymer, an acrylic resin, a fluororesin, a urethane resin, a phenol resin, a urea resin, an epoxy resin, a cellulose-based resin, an unsaturated polyester resin, a melamine resin, a silicone resin, a copolymer or alloy thereof, a modified product thereof, and a foamed product (foam) thereof; a timber; a cushioning member including fibers such as cotton and wool fibers; and the like.

A layered body configured from plural of the above materials may also be employed.

Forming the present embodiment such that the thickness da and the storage modulus E′a of the first member 220, and the thickness db and the storage modulus E′b of the second member 222, satisfy the relationship Equation (a) given above enables provision of the sensor module 200 in which shock and vibration are not prone to be transmitted from the base section 20B side, and in which pressure is readily transmitted from the press section 20A.

(Method of Producing the Sensor Module)

In order to produce the sensor module 200 of the present embodiment, first the piezoelectric substrate 10 is laid in a straight line on the surface of the second member 222. The sensor module 200 is then formed by placing the first member 220 on top of both the second member 222 and the piezoelectric substrate 10, and fixing the first member 220 thereto.

In the sensor module 200 of the present embodiment, a covering member covering the piezoelectric substrate 10 possesses pressure sensitive self-adhesive properties. This means that the piezoelectric substrate 10 is fixed to the first member 220 and the second member 222 by utilizing the pressure sensitive self-adhesive properties of the covering member.

Moreover, outer peripheral edge portions of the first member 220 and the second member 222 are fixed together by an adhesive agent (not illustrated in the drawings). Note that the method employed to fix the first member 220 and the second member 222 together is not limited to fixing by adhesive agent, and they may be fixed together using a pressure sensitive adhesive or a pressure sensitive adhesive tape (such as a double-sided tape, for example).

When fixing the piezoelectric substrate 10, raised portions on the sensor module due to the volume of the piezoelectric substrate 10 can be prevented from arising by forming a groove corresponding to the piezoelectric substrate 10 in the surface of one or other out of the first member 220 or the second member 222.

(Piezoelectric Substrate)

An outline of the piezoelectric substrate employed to detect pressure in the attachment structure 100 of the present embodiment will now be described.

The piezoelectric substrate of the present embodiment includes an elongate conductor, and an elongate first piezoelectric material helically wound in one direction around the conductor. The first piezoelectric material includes an optically active helical chiral polymer (A) (hereinafter also simply referred to as “helical chiral polymer (A)”). A lengthwise direction of the first piezoelectric material and a principal orientation direction of the helical chiral polymer (A) included in the first piezoelectric material are substantially parallel to each other. The first piezoelectric material has a degree of orientation F in a range of from 0.5 up to but not including 1.0, determined from X-ray diffraction measurement by the following Formula (b): degree of orientation F=(180°−α)/180°  (b).

In Formula (b), α represents a half width of a peak due to orientation. The unit of α is “°”.

In the following description of the piezoelectric substrate of the present embodiment, “elongate conductor” may be simply referred to in the description as “conductor”, and “elongate first piezoelectric material” may be simply referred to in the description as “first piezoelectric material”.

Here, the degree of orientation F of the first piezoelectric material is an index indicating the degree of orientation of the helical chiral polymer (A) included in the first piezoelectric material, such as a degree of orientation in a c-axis measured by a wide-angle X-ray diffractometer (RINT 2550 manufactured by Rigaku Corporation, attachment device: rotational sample table, X-ray source: CuKα, output: 40 kV, 370 mA, detector: scintillation counter).

Examples of a method of measuring the degree of orientation F of the first piezoelectric material are as described in examples described later.

“One direction” refers to a direction in which the first piezoelectric material is wound around the conductor from the near side to the far side when viewing the piezoelectric substrate of the present embodiment from one axial direction end of the conductor. Specifically, “one direction” refers to a right direction (right-handed, i.e., clockwise) or a left direction (left-handed, i.e., counterclockwise).

Due to including such a configuration, the piezoelectric substrate of the present embodiment is excellent in piezoelectric sensitivity and also excellent in the piezoelectric output stability.

More specifically, the piezoelectric substrate of the present embodiment exhibits piezoelectric properties due to the first piezoelectric material including the helical chiral polymer (A), the lengthwise direction of the first piezoelectric material and the principal orientation direction of the helical chiral polymer (A) being substantially parallel to each other, and the degree of orientation F of the first piezoelectric material being from 0.5 up to but not including 1.0.

Moreover, the piezoelectric substrate of the present embodiment has a configuration in which the first piezoelectric material is helically wound in one direction around the conductor.

In the piezoelectric substrate of the present embodiment, due to the first piezoelectric material being arranged in the manner described above, a shear force is applied to the helical chiral polymer (A) when tension (stress) has been applied to the piezoelectric substrate in the lengthwise direction, and polarization of the helical chiral polymer (A) occurs along the radial directions of the piezoelectric substrate. When the helically wound first piezoelectric material is regarded as being an aggregate body of micro regions micronized to the extent that they approximate to flat planes along the lengthwise direction of the first piezoelectric material, application to the helical chiral polymer of a shear force caused by tension (stress) acting on the flat planes configuring the micro regions results in the direction of such polarization substantially coinciding with the direction of an electric field generated due to a piezoelectric stress constant d₁₄.

Specifically, in polylactic acids for example, in the case of a homopolymer (PLLA) of L-lactic acid having a molecular structure including a left-handed helical structure, application of tension (stress) to a left-handed helically wound structure, in which a first piezoelectric material having a lengthwise direction substantially parallel to the principal orientation direction of the PLLA has been wound around a conductor in a left-handed manner, results in generation of an electric field (polarization) parallel to radial directions and acting in directions from the center of a circle of a circular cross-section perpendicular to the tension toward the outside. Conversely, when tension (stress) has been applied to a right-handed helically wound structure, in which a first piezoelectric material piezoelectric material having a lengthwise direction substantially parallel to the principal orientation direction of the PLLA has been wound around a conductor in a right-handed manner, this results in generation of an electric field (polarization) parallel to radial directions, but acting in directions from the outside of a circle of a circular cross-section perpendicular to the tension toward the center thereof.

Moreover, for example, in the case of a homopolymer (PDLA) of D-lactic acid having a molecular structure including a right-handed helical structure, application of tension (stress) to a left-handed helically wound structure, in which a first piezoelectric material having a lengthwise direction substantially parallel to the principal orientation direction of the PDLA has been wound around a conductor in a left-handed manner, results in generation of an electric field (polarization) parallel to radial directions and acting in directions from the outside of a circle of a circular cross-section perpendicular to the tension, toward the center thereof. Conversely, when tension (stress) is applied to a right-handed helically wound structure, in which a first piezoelectric material piezoelectric material having a lengthwise direction substantially parallel to the principal orientation direction of the PDLA has been wound around a conductor in a right-handed manner, this results in generation of an electric field (polarization) parallel to radial directions, but acting in directions from the center of a circle of a circular cross-section perpendicular to the tension, toward the outside

As a result, when tension has been applied to the piezoelectric substrate in the lengthwise direction, a voltage signal proportional to this tension is thought to be effectively detectable due to respective potential differences proportional to the tension being generated at each site of the helically arranged first piezoelectric material in a state of phase alignment.

Therefore, a piezoelectric substrate that is excellent in piezoelectric sensitivity and also excellent in the piezoelectric output stability can be obtained according to the piezoelectric substrate of the present embodiment.

In particular, the stability of piezoelectric sensitivity and the piezoelectric output stability (stability with respect to time or change in temperature) in a piezoelectric substrate using a non-pyroelectric polylactic acid-based polymer as the helical chiral polymer (A) are improved in comparison to those of a piezoelectric substrate using PVDF that has pyroelectric properties.

In the piezoelectric unit provided with a fiber having piezoelectric properties described in Patent Document 4, the direction in which the fiber having piezoelectric properties is wound around a conductive fiber is not limited therein, and both origin and direction of force configuring a shear force are different from those of the piezoelectric substrate of the present embodiment. Piezoelectric sensitivity is accordingly thought to be insufficient due to polarization not occurring along the radial directions of the piezoelectric unit. Namely, polarization does not occur in the direction of an electric field generated due to a piezoelectric stress constant d₁₄, even in cases in which tension is applied to the piezoelectric unit described in Patent Document 4.

The lengthwise direction of the first piezoelectric material and the principal orientation direction of the helical chiral polymer (A) being substantially parallel to each other is advantageous from the perspective of the first piezoelectric material being strong to tension in the lengthwise direction (i.e., has excellent tensile strength in the lengthwise direction). The first piezoelectric material is accordingly not liable to break even when being helically wound in one direction around the conductor.

In addition, the lengthwise direction of the first piezoelectric material and the principal orientation direction of the helical chiral polymer (A) being substantially parallel to each other is also advantageous from the perspective of ease of manufacture when, for example, a stretched piezoelectric film is slit to obtain the first piezoelectric material (for example, a slit ribbon thereof).

Herein, “substantially parallel” indicates that an angle formed between two line segments is from 0° up to but not including 30° (preferably from 0° to 22.5°, more preferably from 0° to 10°, still more preferably from 0° to 5°, and particularly preferably from 0° to 3°).

Herein, the principal orientation direction of the helical chiral polymer (A) means the main orientation direction of the helical chiral polymer (A). The principal orientation direction of the helical chiral polymer (A) can be confirmed by measuring the degree of orientation F of the first piezoelectric material.

In cases in which a raw material is melted and spun before stretching to produce the first piezoelectric material, the principal orientation direction of the helical chiral polymer (A) in the produced first piezoelectric material means the principal stretching direction. The principal stretching direction refers to the direction in which stretching is performed.

Likewise, in cases in which a film is stretched, and slits are made in the stretched film to produce the first piezoelectric material, the principal orientation direction of the helical chiral polymer (A) in the produced first piezoelectric material means a principal stretching direction. The principal stretching direction refers here to the stretching direction in cases of monoaxial stretching, or refers here to the stretching direction having the higher stretching ratio in cases of biaxial stretching.

A first embodiment of the piezoelectric substrate in the invention will be described in detail below.

(Piezoelectric Substrate of First Embodiment)

In the piezoelectric substrate of the first embodiment, the elongate conductor is preferably an inner conductor, and the elongate first piezoelectric material is preferably helically wound in one direction around the outer peripheral surface of the inner conductor.

Utilizing the inner conductor as the conductor facilitates the helical arrangement of the first piezoelectric material in one direction while maintaining the first piezoelectric material at a helix angle β with respect to the axial direction of the inner conductor.

“Helix angle β” means here an angle formed between the axial direction of the conductor and the arrangement direction of the first piezoelectric material with respect to the axial direction of the conductor (the lengthwise direction of the first piezoelectric material).

This facilitates the generation of polarization of the helical chiral polymer (A) along the radial directions of the piezoelectric substrate when, for example, tension is applied in the lengthwise direction of the piezoelectric substrate. As a result, a voltage signal (charge signal) proportional to the tension is effectively detected as an electrical characteristic.

In addition, a piezoelectric substrate configured as described above has the same structure as the internal structure provided in a coaxial cable (i.e. an inner conductor and a dielectric body). A structure that has high electromagnetic shielding properties and is resistant to noise is accordingly obtained when, for example, the piezoelectric substrate described above is applied to a coaxial cable.

The piezoelectric substrate of the first embodiment preferably further includes an elongate second piezoelectric material helically wound in a direction different from the one direction.

In addition, preferably the second piezoelectric material includes an optically active helical chiral polymer (A), the lengthwise direction of the second piezoelectric material and the principal orientation direction of the helical chiral polymer (A) included in the second piezoelectric material are substantially parallel to each other, the degree of orientation F of the second piezoelectric material, determined from X-ray diffraction measurement by Formula (b), is in a range of from 0.5 up to but not including 1.0, and the chirality of the helical chiral polymer (A) included in the first piezoelectric material and the chirality of the helical chiral polymer (A) included in the second piezoelectric material differ from each other.

Polarization thereby occurs in both the helical chiral polymer (A) included in the first piezoelectric material and the helical chiral polymer (A) included in the second piezoelectric material when, for example, tension has been applied in the lengthwise direction of the piezoelectric substrate. Each of these polarization directions is along the radial directions of the piezoelectric substrate.

As a result, a voltage signal (charge signal) proportional to the tension is more effectively detected. Accordingly, piezoelectric sensitivity and piezoelectric output stability are further improved.

In particular, in cases in which the piezoelectric substrate of the first embodiment includes a first outer conductor and a piezoelectric material formed into a double-layer structure that includes the first piezoelectric material and the second piezoelectric material, the first piezoelectric material and the second piezoelectric material can be brought into close contact with the inner conductor and the first outer conductor so as to form few voids therebetween. This facilitates efficient transmission of an electric field generated by tension to an electrode. Such a form of the piezoelectric material is accordingly well suited to achieving a sensor of higher sensitivity.

From the viewpoint of improving piezoelectric sensitivity and piezoelectric output stability, the piezoelectric substrate of the first embodiment preferably further includes a first insulator helically wound around the outer peripheral surface of the inner conductor, and the first insulator is preferably arranged on the opposite side from the inner conductor as viewed from the first piezoelectric material.

For example, in cases in which the piezoelectric substrate of the first embodiment includes a first outer conductor, gaps are readily formed in the wound first piezoelectric material if the piezoelectric substrate is repeatedly bent or the piezoelectric substrate is bent at a small curvature radius, giving rise to the possibility of the inner conductor and the first outer conductor electrically short-circuiting. Arranging the first insulator in such cases, however, enables the inner conductor and the first outer conductor to be more reliably electrically isolated from each other. This also enables high reliability to be achieved in applications employing a bent piezoelectric substrate.

Preferably the piezoelectric substrate of the first embodiment further includes an elongate second piezoelectric material wound in a direction different from the one direction. Herein, the second piezoelectric material includes an optically active helical chiral polymer (A), a lengthwise direction of the second piezoelectric material and a principal orientation direction of the helical chiral polymer (A) included in the second piezoelectric material are substantially parallel to each other, a degree of orientation F of the second piezoelectric material, determined from X-ray diffraction measurement by Formula (b), is in a range of from 0.5 up to but not including 1.0. The first piezoelectric material and the second piezoelectric material alternately intersect each other to form a braided structure, and a chirality of the helical chiral polymer (A) included in the first piezoelectric material and a chirality of the helical chiral polymer (A) included in the second piezoelectric material differ from each other.

Polarization thereby accordingly occurs in both the helical chiral polymer (A) included in the first piezoelectric material and the helical chiral polymer (A) included in the second piezoelectric material when, for example, tension has been applied in the lengthwise direction of the piezoelectric substrate. Each of these polarization directions is along the radial directions of the piezoelectric substrate.

A voltage signal proportional to the tension is thereby more effectively detected. As a result the piezoelectric sensitivity and piezoelectric output stability are further improved.

In particular, in cases in which the piezoelectric substrate of the first embodiment includes a first outer conductor and a piezoelectric material including the first piezoelectric material and the second piezoelectric material formed into a braided structure, an appropriate level of voids is formed between the first piezoelectric material and the second piezoelectric material. The voids accordingly absorb deformation when a force acts on the piezoelectric material to cause bending deformation therein, facilitating supple bending deformation of the piezoelectric substrate. This thereby enables the piezoelectric substrate of the first embodiment to be suitably used, for example, as a configuration member to be conformed to a three-dimensional plane, such as in a wearable product.

From the viewpoint of improving piezoelectric sensitivity and piezoelectric output stability, the piezoelectric substrate of the first embodiment preferably further includes a first insulator wound around the outer peripheral surface of the inner conductor, wherein the first piezoelectric material and the first insulator alternately intersect each other to form a braided structure.

This makes it easier to maintain a state in which the first piezoelectric material is wound around the inner conductor in one direction when the piezoelectric substrate is undergoing bending deformation. There are preferably no gaps between the first piezoelectric material and the first insulator in the braided structure of such an aspect from the viewpoint that this facilitates the application of tension to the first piezoelectric material.

From the viewpoint of improving piezoelectric sensitivity and piezoelectric output stability, in the piezoelectric substrate of the first embodiment, the first piezoelectric material is preferably wound so as to maintain an angle of from 15° to 75° (45°±30°), and more preferably wound so as to maintain an angle of from 35° to 55° (45°±10°), with respect to the axial direction of the inner conductor.

From the viewpoint of improving piezoelectric sensitivity and piezoelectric output stability, in the piezoelectric substrate of the first embodiment, the first piezoelectric material preferably has a fiber shape that includes a single or plural bundles, and the major axis diameter of a cross-section of the first piezoelectric material is preferably from 0.0001 mm to 10 mm, more preferably from 0.001 mm to 5 mm, and still more preferably from 0.002 mm to 1 mm.

“Major axis diameter of cross-section” is equivalent to “diameter” in cases in which a cross-section of the first piezoelectric material (preferably a fibrous piezoelectric material) has a circular profile.

In cases in which a cross-section of the first piezoelectric material has an irregular profile, the “major axis diameter of cross-section” is the longest width from out of such cross-sectional widths.

In cases in which the first piezoelectric material is a piezoelectric material configured from plural bundles, the “major axis diameter of cross-section” is the major axis diameter of a cross-section of the piezoelectric material configured from the plural bundles.

From the viewpoint of improving the piezoelectric sensitivity and piezoelectric output stability in the piezoelectric substrate of the present embodiment (for example, in the piezoelectric substrate of the first embodiment), the first piezoelectric material preferably has an elongate flat plate shape. The thickness of the first piezoelectric material is from 0.001 mm to 0.2 mm, the width of the first piezoelectric material is from 0.1 mm to 30 mm, and a ratio of the width of the first piezoelectric material to the thickness of the first piezoelectric material is 2 or more.

The dimensions (thickness, width, and ratios (width/thickness, and length/width)) of the first piezoelectric material having an elongate flat plate shape (hereinafter also referred to as “elongate-flat-plate-shaped piezoelectric material”) will be described in more detail below.

The first piezoelectric material preferably has a thickness of from 0.001 mm to 0.2 mm.

A thickness of 0.001 mm or more secures the strength of the elongate-flat-plate-shaped piezoelectric material to be secured. This is also excellent in terms of ease of production of the elongate-flat-plate-shaped piezoelectric material.

A thickness of 0.2 mm or less results improves the degrees of freedom for deformation (flexibility) of the elongate-flat-plate-shaped piezoelectric material in the thickness direction.

In addition, the width of the first piezoelectric material is preferably from 0.1 mm to 30 mm.

A width of 0.1 mm or more secures the strength of the first piezoelectric material (elongate-flat-plate-shaped piezoelectric material). This is also excellent in terms of ease of production of the elongate-flat-plate-shaped piezoelectric material (for example, in terms of the ease of production in a slitting process, described later).

A width of 30 mm or less results in improvement in the degrees of freedom for deformation (flexibility) of the elongate-flat-plate-shaped piezoelectric material.

In addition, a ratio of the width of the first piezoelectric material to the thickness of the first piezoelectric material (hereinafter also referred to as “ratio (width/thickness)”) is preferably 2 or more.

When the ratio (width/thickness) is 2 or more, the principal faces are clearly defined, thereby facilitating formation of an electrode layer (for example, an outer conductor) having a uniform orientation over the lengthwise direction of the first piezoelectric material (elongate-flat-plate-shaped piezoelectric material). For example, an outer conductor is easily formed on at least one of the principal faces. This is accordingly excellent in terms of piezoelectric sensitivity, and also excellent in terms of the stability of the piezoelectric sensitivity.

The width of the first piezoelectric material is more preferably from 0.5 mm to 15 mm.

When the width is 0.5 mm or more, there is a greater improvement in the strength of the first piezoelectric material (elongate-flat-plate-shaped piezoelectric material). In addition, twisting of the elongate-flat-plate-shaped piezoelectric material can also be better inhibited, thereby enabling the piezoelectric sensitivity and the stability thereof to be further improved.

A width of 15 mm or less results in a greater improvement in the degrees of freedom for deformation (flexibility) of the elongate-flat-plate-shaped piezoelectric material.

The ratio of the length to the width (hereinafter also referred to as “ratio (length/width)”) of the first piezoelectric material is preferably 10 or more.

When the ratio (length/width) is 10 or more, there is a greater improvement in the degrees of freedom for deformation (flexibility) of the first piezoelectric material (elongate-flat-plate-shaped piezoelectric material). In addition, piezoelectric properties can be imparted more extensively to a piezoelectric device (such as a piezoelectric textile or a piezoelectric fabric) in which elongate-flat-plate-shaped piezoelectric materials are appropriately employed.

In the piezoelectric substrate of the present embodiment, a functional layer is preferably arranged on at least one principal face of the first piezoelectric material from the viewpoint of improving the piezoelectric sensitivity and piezoelectric output stability in cases in which the first piezoelectric material has an elongate flat plate shape.

The functional layer preferably includes at least one of an adhesion facilitation layer, a hard coat layer, an antistatic layer, an antiblock layer, a protective layer, or an electrode layer.

This further facilitates application to, for example, a piezoelectric device (such as a piezoelectric textile or a piezoelectric fabric), a force sensor, an actuator, or a biodata acquisition device.

The functional layer preferably includes an electrode layer.

This enables a connection between the first outer conductor and the conductor (preferably an inner conductor) to be more easily made in cases in which the piezoelectric substrate is being employed as one of the configuration elements of, for example, a piezoelectric device (such as a piezoelectric textile or a piezoelectric fabric), a force sensor, an actuator, or a biodata acquisition device. This facilitates detection of a voltage signal corresponding to tension when tension has been applied to the piezoelectric substrate of the present embodiment.

In the piezoelectric substrate of the present embodiment, preferably at least one surface layer of a layered body including the first piezoelectric material and the functional layer is the electrode layer.

This enables a connection between the first outer conductor or the conductor (preferably an inner conductor) and the layered body to be more easily made in cases in which the piezoelectric substrate is being employed as one of the configuration elements of, for example, a piezoelectric device (such as a piezoelectric textile or a piezoelectric fabric), a force sensor, an actuator, or a biodata acquisition device. This facilitates detection of a voltage signal corresponding to tension when tension has been applied to the piezoelectric substrate of the present embodiment.

In the piezoelectric substrate of the present embodiment, the conductor is preferably a tinsel wire.

The form of the tinsel wire has a structure in which a rolled copper foil is helically wound around a fiber. Employing copper that has a high electric conductivity enables the output impedance to be decreased. This facilitates detection of a voltage signal corresponding to tension when tension has been applied to the piezoelectric substrate of the present embodiment. As a result, piezoelectric sensitivity and piezoelectric output stability are further improved.

The piezoelectric substrate of the present embodiment preferably includes an adhesive layer between the conductor and the first piezoelectric material.

The relative position of the conductor and the first piezoelectric material is thereby inhibited from shifting, facilitating application of tension to the first piezoelectric material, and facilitating application of a shear stress to the helical chiral polymer (A) included in the first piezoelectric material. This enables a voltage output proportional to the tension to be effectively detected from the conductor (preferably a signal line conductor). The inclusion of the adhesive layer results in a further increase in the absolute value of the amount of generated charge per unit tensile force.

In the piezoelectric substrate of the present embodiment, the helical chiral polymer (A) included in the first piezoelectric material is preferably a polylactic acid-based polymer having a main chain including a repeating unit represented by the following Formula (1), from the viewpoint of further improving piezoelectric properties.

In the piezoelectric substrate of the present embodiment, the helical chiral polymer (A) included in the first piezoelectric material preferably has an optical purity of 95.00% ee or more, from the viewpoint of further improving piezoelectric properties.

In the piezoelectric substrate of the present embodiment, the helical chiral polymer (A) included in the first piezoelectric material is preferably D-form or L-form, from the viewpoint of further improving piezoelectric properties.

In the piezoelectric substrate of the present embodiment, the content of the helical chiral polymer (A) included in the first piezoelectric material is preferably 80% by mass or more with respect to the total amount of the first piezoelectric material, from the viewpoint of further improving piezoelectric properties.

The piezoelectric substrate of the present embodiment preferably further includes a first outer conductor at an outer periphery.

“Outer periphery” here means an outer peripheral portion of the piezoelectric substrate.

This enables electrostatic shielding to be achieved, and for fluctuations in the voltage of the conductor (preferably an inner conductor) arising from the effects of external static electricity to be suppressed.

The piezoelectric substrate of the present embodiment preferably further includes a second insulator at the outer periphery of the first outer conductor.

Due to the piezoelectric substrate of the present embodiment including the second insulator, the ingress of liquids such as water or sweat, and the ingress of dust or the like, from outside can be suppressed. This enables generation of leakage current between the conductor (preferably an inner conductor) and the outer conductor, caused by water, sweat, dust, or the like, to be suppressed. As a result, this enables a stable output to be achieved that is robust to various environmental changes and is not liable to fluctuate in sensitivity, in cases in which the piezoelectric substrate is used as one of the configuration elements of, for example, a piezoelectric device (such as a piezoelectric textile or a piezoelectric fabric), a force sensor, an actuator, or a biodata acquisition device.

A specific aspect A of the piezoelectric substrate according to the first embodiment will be described below, with reference to the drawings.

(Specific Aspect A)

FIG. 2A is a side view illustrating the specific aspect A of the piezoelectric substrate according to the first embodiment. FIG. 2B is a cross-section taken along the line X-X′ of FIG. 2A.

A piezoelectric substrate 10 of the specific aspect A includes an elongate inner conductor 12A as the conductor, an elongate first piezoelectric material 14A, and an adhesive layer (not illustrated) interposed between the inner conductor 12A and the first piezoelectric material 14A.

As illustrated in FIG. 2A, the first piezoelectric material 14A is helically wound at a helix angle β1 around the outer peripheral surface of the inner conductor 12A in one direction from one end to the other end thereof so that there is no gap present therebetween.

“Helix angle β1” means an angle formed between an axial direction G1 of the inner conductor 12A and the arrangement direction of the first piezoelectric material 14A with respect to the axial direction of the inner conductor 12A.

In the specific aspect A, the first piezoelectric material 14A is wound in a left-handed manner around the inner conductor 12A. Specifically, the first piezoelectric material 14A is wound in a left-handed manner from the near side to the far side of the inner conductor 12A when the piezoelectric substrate 10 is viewed from one axial direction end of the inner conductor 12A (at the right end side in FIG. 2A).

In FIG. 2A, the principal orientation direction of the helical chiral polymer (A) included in the first piezoelectric material 14A is indicated by the double-headed arrow E1. In other words, the principal orientation direction of the helical chiral polymer (A) and the arrangement direction of the first piezoelectric material 14A (the lengthwise direction of the first piezoelectric material 14A) are substantially parallel to each other.

The adhesive layer (not illustrated) is interposed between the inner conductor 12A and the first piezoelectric material 14A. The piezoelectric substrate 10 of the specific aspect A is thereby configured so that the relative position of the first piezoelectric material 14A and the inner conductor 12A does not shift even when tension is applied to the piezoelectric substrate 10 in the lengthwise direction thereof.

The operation and advantageous effects of the piezoelectric substrate 10 of the specific aspect A will be described below.

For example, when tension is applied to the piezoelectric substrate 10 in the lengthwise direction thereof, a shear force is applied to the helical chiral polymer (A) included in the first piezoelectric material 14A, thereby polarizing the helical chiral polymer (A). The polarization of the helical chiral polymer (A) is thought to occur along the radial directions of the piezoelectric substrate 10, as indicated by the arrows in FIG. 2B, with the polarization occurring in-phase with each other. As a result, a voltage signal proportional to the tension is effectively detected.

Furthermore, in the piezoelectric substrate 10 of the specific aspect A, tension is more readily applied to the first piezoelectric material 14A due to the adhesive layer being interposed between the inner conductor 12A and the first piezoelectric material 14A.

Due to the above configuration, the piezoelectric substrate 10 of the specific aspect A is excellent in piezoelectric sensitivity and is excellent in piezoelectric output stability.

A specific aspect B of the piezoelectric substrate according to the first embodiment will now be described, with reference to the drawings. In the following description, configuration the same as the specific aspect A is appended with the same reference signs, and duplicate description is omitted thereof.

(Specific Aspect B)

FIG. 3 is a side view illustrating the specific aspect B of the piezoelectric substrate according to the first embodiment.

A piezoelectric substrate 10A of the specific aspect B differs from the piezoelectric substrate 10 of the first aspect in including an elongate second piezoelectric material 14B.

The chirality of the helical chiral polymer (A) included in the first piezoelectric material 14A and the chirality of a helical chiral polymer (A) included in the second piezoelectric material 14B differ from each other.

Similarly to in the specific aspect A, the first piezoelectric material 14A is helically wound at a helix angle β1 around the outer peripheral surface of the inner conductor 12A in one direction from one end to the other end so that there are no gaps present therebetween.

However, the second piezoelectric material 14B is helically wound in the reverse direction to the direction of winding the first piezoelectric material 14A at a helix angle β2, which is substantially the same angle as the helix angle β1, around the outer peripheral surface of the first piezoelectric material 14A, as illustrated in FIG. 3 .

“Helix angle β2” is defined in a similar manner to the helix angle (31 described above.

The “reverse direction to the direction of winding of the first piezoelectric material 14A” in the specific aspect B refers here to being right-handed. In other words, the second piezoelectric material 14B is wound in a right-handed manner from the near side to the far side of the inner conductor 12A when the piezoelectric substrate 10A is viewed from one end in an axial direction G2 of the inner conductor 12A (at the right end side in FIG. 3 ).

In FIG. 3 , the principal orientation direction of the helical chiral polymer (A) included in the second piezoelectric material 14B is indicated by the double-headed arrow E2. In other words, the principal orientation direction of the helical chiral polymer (A) included in the second piezoelectric material 14B and the arrangement direction of the second piezoelectric material 14B (the lengthwise direction of the second piezoelectric material 14B) are substantially parallel to each other.

The operation of the piezoelectric substrate 10A of the specific aspect B will be described below.

For example, when tension is applied to the piezoelectric substrate 10A in the lengthwise direction thereof, a shear stress is applied to both the helical chiral polymer (A) included in the first piezoelectric material 14A and the helical chiral polymer (A) included in second piezoelectric material 14B, and polarization accordingly occurs therein. Each of the polarization directions is along the radial directions of the piezoelectric substrate 10A. A voltage signal proportional to the tension is accordingly effectively detected.

Due to the above configuration, the piezoelectric substrate 10A of the specific aspect B achieves greater improvements in the piezoelectric sensitivity and piezoelectric output stability.

In particular, in cases in which the piezoelectric substrate 10A of the specific aspect B includes an outer conductor, due to the piezoelectric material including the first piezoelectric material and the second piezoelectric material formed in a double-layer structure, this enables the first piezoelectric material and the second piezoelectric material to be brought into close contact with the inner conductor and the outer conductor so as to form few voids therebetween. This facilitates efficient transmission of an electric field generated by tension to an electrode. Such a form of the piezoelectric material is accordingly well suited to achieving a sensor of higher sensitivity.

A specific aspect C of the piezoelectric substrate according to the first embodiment will now be described, with reference to the drawings. In the following description, the same reference signs are appended to the same configuration as that in the specific aspect A and the specific aspect B, and duplicate explanation thereof will be omitted.

(Specific Aspect C)

FIG. 4 is a side view illustrating a specific aspect C of the piezoelectric substrate according to the first embodiment.

A piezoelectric substrate 10B of the specific aspect C differs from the piezoelectric substrate 10A of the specific aspect B in that a first piezoelectric material 14A and a second piezoelectric material 14B alternately intersect each other to form a braided structure.

The chirality of a helical chiral polymer (A) included in the first piezoelectric material 14A and the chirality of a helical chiral polymer (A) included in the second piezoelectric material 14B differ from each other.

As illustrated in FIG. 4 , in the piezoelectric substrate 10B of the specific aspect C, the first piezoelectric material 14A is helically wound in a left-handed manner at a helix angle (31 with respect to an axial direction G3 of an inner conductor 12A, and the second piezoelectric material 14B is helically wound in a right-handed manner at a helix angle (32 with respect thereto. The first piezoelectric material 14A and the second piezoelectric material 14B alternately intersect each other.

In the braided structure illustrated in FIG. 4 , the principal orientation direction (double-headed arrow E1) of the helical chiral polymer (A) included in first piezoelectric material 14A and the arrangement direction of the first piezoelectric material 14A are substantially parallel to each other. Similarly, the principal orientation direction (double-headed arrow E2) of the helical chiral polymer (A) included in the second piezoelectric material 14B and the arrangement direction of the second piezoelectric material 14B are substantially parallel to each other.

The operation and advantageous effects of the piezoelectric substrate 10B of the specific aspect C will be described below.

Similarly to in the specific aspect B, polarization occurs in both of the helical chiral polymer (A) included in the first piezoelectric material 14A and the helical chiral polymer (A) included in second piezoelectric material 14B when, for example, tension is applied to the piezoelectric substrate 10B in the lengthwise direction thereof. Each of the polarization directions is along the radial directions of the piezoelectric substrate 10B. As a result, a voltage signal proportional to the tension is effectively detected.

Due to the above configuration, the piezoelectric substrate 10B of the specific aspect C results achieves a greater improvement in piezoelectric sensitivity and piezoelectric output stability.

In particular, in cases in which the piezoelectric substrate 10B of the specific aspect C includes an outer conductor, when tension has been applied in the lengthwise direction of the piezoelectric substrate 10B, a shear stress is applied to the left-hand-wound first piezoelectric material and the right-hand-wound second piezoelectric material forming the braided structure. The polarization directions thereof are aligned with each other, a volume fraction contributing to the piezoelectric performance of the insulator (i.e., the first piezoelectric material and the second piezoelectric material) between the inner conductor and the outer conductor is increased, and the piezoelectric performance is therefore further improved. This thereby enables the piezoelectric substrate 10B of the specific aspect C to be suitably used, for example, as a configuration member to be conformed to a three-dimensional plane, such as in a wearable product.

The conductor, the first piezoelectric material, and the like included in the piezoelectric substrate of the present embodiment will be described below.

<Conductor>

The piezoelectric substrate of the present embodiment includes an elongate conductor.

The conductor (for example, an inner conductor) in the present embodiment is preferably a signal line conductor.

The signal line conductor refers to a conductor for efficiently detecting an electrical signal from the first piezoelectric material or the second piezoelectric material. Specifically, the signal line conductor is a conductor for detecting a voltage signal (charge signal) corresponding to tension applied when tension has been applied to the piezoelectric substrate of the present embodiment.

The conductor is preferably a good electrical conductor. Examples that may be employed as the conductor include a copper wire, an aluminum wire, an SUS wire, a metal wire coated with an insulating covering layer, a carbon fiber, a resin fiber integrated with a carbon fiber, a tinsel wire, an organic conductive material, and the like. The tinsel wire refers to a wire formed by spirally winding a copper foil around a fiber. Among such conductors, a tinsel wire and a carbon fiber are preferred from the viewpoint of improving piezoelectric sensitivity and piezoelectric output stability, and imparting high flexibility.

In particular, a tinsel wire is preferably used in an application having low electrical resistivity and requiring flexibility and pliability (for example, an application such as a wearable sensor built into clothing).

A carbon fiber is preferably used in processing applications to produce textiles or fabrics that demand very high flexibility and suppleness (for example, a piezoelectric textile, a piezoelectric fabric, or a piezoelectric sensor (a textile-form piezoelectric sensor or a fabric-form piezoelectric sensor)).

Suppleness and high flexibility are demanded in cases in which the piezoelectric substrate of the present embodiment is used as a fiber to be processed into a piezoelectric textile or a piezoelectric fabric. A yarn-form or fibrous signal line conductor is preferred in such applications. A piezoelectric substrate including a yarn-form or fibrous signal line conductor has high flexibility, and is therefore well suited to processing with a weaving machine or a knitting machine.

<First Piezoelectric Material>

The piezoelectric substrate of the present embodiment includes the elongate first piezoelectric material.

The first piezoelectric material is a piezoelectric material including an optically active helical chiral polymer (A).

(Helical Chiral Polymer (A))

The first piezoelectric material in the present embodiment includes an optically active helical chiral polymer (A).

Here, “optically active helical chiral polymer” refers to a polymer having a helical molecular structure and having molecular optical activity.

Examples of the helical chiral polymer (A) include polypeptides, cellulose derivatives, polylactic acid-based polymers, polypropylene oxide, and poly(β-hydroxybutyric acid).

Examples of the polypeptides include poly(glutaric acid γ-benzyl) and poly(glutaric acid γ-methyl).

Examples of the cellulose derivatives include cellulose acetate and cyanoethyl cellulose.

From the viewpoint of improving the piezoelectric properties of the first piezoelectric material, the helical chiral polymer (A) preferably has an optical purity of 95.00% ee or more, more preferably 96.00% ee or more, still more preferably 99.00% ee or more, and even more preferably 99.99% ee or more. The helical chiral polymer (A) desirably has an optical purity of 100.00% ee. Adopting an optical purity of the helical chiral polymer (A) in the above ranges raises the ease-of-packing of polymer crystals that exhibit piezoelectric properties, and this is thought to consequently result in improved piezoelectric properties.

The optical purity of the helical chiral polymer (A) referred to here is a value calculated by the following Formula. Optical purity (% ee)=100×|L-form amount−D-form amount|/(L-form amount+D-form amount)

In other words, the optical purity of the helical chiral polymer (A) is a value obtained by multiplying by “100” (by obtaining the product by 100 of) “a numerical value obtained by dividing (by obtaining the quotient of) ‘the difference (absolute value) between the amount (mass %) of helical chiral polymer (A) in L-form and the amount (mass %) of helical chiral polymer (A) in D-form’ by ‘the total amount of the amount (mass %) of helical chiral polymer (A) in L-form and the amount (mass %) of helical chiral polymer (A) in D-form’”.

Values obtained by a high performance liquid chromatography (HPLC) method are employed for the amount (mass %) of helical chiral polymer (A) in L-form and the amount (mass %) of helical chiral polymer (A) in D-form. The details of specific measurement will be described later.

A polymer having a main chain including a repeating unit represented by the following Formula (1) is preferably employed as the helical chiral polymer (A) from the viewpoint of increasing the optical purity and improving the piezoelectric properties.

Examples of the polymer having a main chain including a repeating unit represented by the above Formula (1) include a polylactic acid-based polymer.

Polylactic acid-based polymer refers here to “polylactic acid (a polymer consisting of a repeating unit derived from a monomer selected from L-lactic acid or D-lactic acid)”, “a copolymer of L-lactic acid or D-lactic acid and a compound copolymerizable with the L-lactic acid or D-lactic acid”, or a mixture thereof.

Among such polylactic acid-based polymers, polylactic acid is preferred, and a homopolymer (PLLA, also simply referred to as “L-form”) of L-lactic acid or a homopolymer (PDLA, also simply referred to as “D-form”) of D-lactic acid is most preferred.

Polylactic acid is a polymer obtained by polymerizing lactic acid by ester bonding so as to connect together in a long polymer.

Known methods capable of producing polylactic acid include a lactide method involving lactide, a direct polymerization method in which lactic acid is heated in a solvent under reduced pressure so as to be polymerized while removing water, and the like.

Examples of the polylactic acid include a homopolymer of L-lactic acid, a homopolymer of D-lactic acid, a block copolymer including a polymer of at least one of L-lactic acid or D-lactic acid, or a graft copolymer including a polymer of at least one of L-lactic acid or D-lactic acid.

Examples of the “compound copolymerizable with L-lactic acid or D-lactic acid” include: a hydroxycarboxylic acid such as glycolic acid, dimethyl glycolic acid, 3-hydroxybutyric acid, 4-hydroxybutyric acid, 2-hydroxypropanoic acid, 3-hydroxypropanoic acid, 2-hydroxyvaleric acid, 3-hydroxyvaleric acid, 4-hydroxyvaleric acid, 5-hydroxyvaleric acid, 2-hydroxycaproic acid, 3-hydroxycaproic acid, 4-hydroxycaproic acid, 5-hydroxycaproic acid, 6-hydroxycaproic acid, 6-hydroxymethyl caproic acid, and mandelic acid; a cyclic ester such as glycolide, β-methyl-δ-valerolactone, γ-valerolactone, and ε-caprolactone; a polycarboxylic acid such as oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, terephthalic acid, and an anhydride thereof; a polyalcohol such as ethylene glycol, diethylene glycol, triethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,9-nonanediol, 3-methyl-1,5-pentanediol, neopentyl glycol, tetramethylene glycol, and 1,4-hexanedimethanol; a polysaccharide such as cellulose; an aminocarboxylic acid such as α-amino acid; and the like.

Examples of the “copolymer of L-lactic acid or D-lactic acid and a compound copolymerizable with the L-lactic acid or the D-lactic acid” include a block copolymer or a graft copolymer having a polylactic acid sequence capable of forming a helical crystal.

The concentration of a copolymer component derived structure in the helical chiral polymer (A) is preferably 20 mol % or less.

For example, in cases in which the helical chiral polymer (A) is a polylactic acid-based polymer, the concentration of the copolymer component derived structure is preferably 20 mol % or less with respect to the total number of moles in the polylactic acid-based polymer of a lactic acid derived structure and a structure derived from the compound copolymerizable with lactic acid (copolymer component).

Examples of methods capable of producing the polylactic acid-based polymer include, for example: a method of obtaining the polymer by direct dehydration condensation of lactic acid, described in JP-A No. S59-096123 and JP-A No. H7-033861; a method of obtaining the polymer by ring-opening polymerization of lactide which is a cyclic dimer of lactic acid, described in U.S. Pat. Nos. 2,668,182 and 4,057,357; and the like.

Moreover, in order to achieve an optical purity of 95.00% ee or more in the polylactic acid-based polymer obtained by the above production methods, lactide having an optical purity improved by crystallization operations to an optical purity of 95.00% ee or more is preferably polymerized when, for example, a polylactic acid is produced by a lactide method.

—Weight Average Molecular Weight—

The weight average molecular weight (Mw) of the helical chiral polymer (A) is preferably from 50,000 to 1,000,000.

The mechanical strength of the first piezoelectric material is improved by making the Mw of the helical chiral polymer (A) 50,000 or more. The above Mw is preferably 100,000 or more, and is still more preferably 200,000 or more.

When obtaining the first piezoelectric material by molding (for example, extrusion molding or melt spinning), the moldability is improved by making the Mw of the helical chiral polymer (A) 1,000,000 or less. The Mw is preferably 800,000 or less, and is still more preferably 300,000 or less.

From the viewpoint of improving the strength of the first piezoelectric material, the molecular weight distribution (Mw/Mn) of the helical chiral polymer (A) is preferably from 1.1 to 5, and more preferably from 1.2 to 4. From 1.4 to 3 is still more preferable therefor.

The weight average molecular weight (Mw) and the molecular weight distribution (Mw/Mn) of the helical chiral polymer (A) refer to values measured using a gel permeation chromatograph (GPC). Mn here is the number-average molecular weight of the helical chiral polymer (A).

An example of a method of measuring Mw and Mw/Mn of the helical chiral polymer (A) using GPC will be described below.

—GPC Measurement Apparatus—

GPC-100, manufactured by Waters Corp.

—Column—

SHODEX LF-804, manufactured by Showa Denko K.K.

—Preparation of Sample—

The first piezoelectric material is dissolved in a solvent (for example, chloroform) at 40° C. to prepare a sample solution having a concentration of 1 mg/mL.

—Measurement Conditions—

0.1 mL of the sample solution is introduced into a column at a temperature of 40° C. and a flow rate of 1 mL/min using chloroform as a solvent.

The concentration of the sample in the sample solution separated by the column is measured by a differential refractometer.

A universal calibration curve is established based on a polystyrene standard sample, and the weight average molecular weight (Mw) and the molecular weight distribution (Mw/Mn) of the helical chiral polymer (A) are calculated.

A commercially available polylactic acid may be used as the polylactic acid-based polymer, serving as an example of the helical chiral polymer (A).

Examples of the commercially available product include PURASORB (PD, PL) manufactured by PURAC Inc., LACEA (H-100, H-400) manufactured by Mitsui Chemical Inc., and INGEO™ BIOPOLYMER manufactured by NatureWorks LLC.

In cases in which a polylactic acid-based polymer is used as the helical chiral polymer (A), the polylactic acid-based polymer is preferably produced by a lactide method or a direct polymerization method in order to achieve a weight average molecular weight (Mw) of the polylactic acid-based polymer of 50,000 or more.

The first piezoelectric material in the present embodiment may contain one kind of such a helical chiral polymer (A) as described above alone, or may contain two or more kinds thereof.

The content of the helical chiral polymer (A) in the first piezoelectric material in the present embodiment (total content when two or more kinds thereof) is preferably 80% by mass or more with respect to the total amount of the first piezoelectric material.

<Stabilizer>

The first piezoelectric material preferably further includes a stabilizer (B) having in one molecule one or more kinds of functional group selected from the group consisting of a carbodiimide group, an epoxy group, and an isocyanate group, and having a weight average molecular weight of from 200 to 60,000. This enables a moist heat resistance thereof to be further improved.

“Stabilizer (B)” described in the paragraphs 0039 to 0055 of WO 2013/054918 may be used as the stabilizer (B).

Examples of compounds including a carbodiimide group in one molecule (carbodiimide compound) that may be used as the stabilizer (B) include a monocarbodiimide compound, a polycarbodiimide compound, and a cyclic carbodiimide compound.

Preferred examples of the monocarbodiimide compound include dicyclohexylcarbodiimide and bis-2,6-diisopropylphenylcarbodiimide.

Polycarbodiimide compounds produced by various methods may be used as such polycarbodiimide compounds. Polycarbodiimide compounds produced by conventional methods for producing polycarbodiimides (for example as described in U.S. Pat. No. 2,941,956, Japanese Patent Publication (JP-B) No. S47-33279, and J. Org. Chem. 28, pp 2069-2075 (1963), Chemical Review 1981, Vol. 81 No. 4, pp 619-621) may be used therefor. Specifically, a carbodiimide compound described in Japanese Patent No. 4084953 may also be used therefor.

Examples of the polycarbodiimide compound include

-   poly(4,4′-dicyclohexylmethanecarbodiimide), -   poly(N,N′-di-2,6-diisopropylphenylcarbodiimide), and -   poly(1,3,5-triisopropylphenylene-2,4-carbodiimide).

The cyclic carbodiimide compound can be synthesized by following, for example, a method described in JP-A No. 2011-256337.

A commercially available product may be used as the carbodiimide compound. Examples thereof include B2756 (trade name) manufactured by Tokyo Chemical Industry Co., Ltd., CARBODILITE LA-1 (trade name) manufactured by Nisshinbo Chemical Inc., and STABAXOL P, STABAXOL P400, and STABAXOL I (each being a trade name) manufactured by Rhein Chemie Rheinau Gmbh.

Examples of a compound (isocyanate compound) that may be used as the stabilizer (B) and includes an isocyanate group in one molecule include 3-(triethoxysilyl)propyl isocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, m-phenylene diisocyanate, p-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4′-diphenylmethane diisocyanate, 2,2′-diphenylmethane diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, and isophorone diisocyanate.

Examples of a compound (epoxy compound) that may be used as the stabilizer (B) and includes an epoxy group in one molecule include phenylglycidyl ether, diethylene glycol diglycidyl ether, bisphenol-A-diglycidyl ether, hydrogenated bisphenol-A-diglycidyl ether, phenol novolac type epoxy resin, cresol novolac type epoxy resin, and epoxidized polybutadiene.

The weight average molecular weight of the stabilizer (B) is from 200 to 60,000 as described above, is more preferably from 200 to 30,000, and is still more preferably from 300 to 18,000.

Achieving a molecular weight within the above range results in the stabilizer (B) moving more easily, and in a moist heat resistance improvement effect being more effectively exhibited.

The weight average molecular weight of the stabilizer (B) is particularly preferably from 200 to 900. Note that a weight average molecular weight being from 200 to 900 is substantially the same as a number-average molecular weight being from 200 to 900. When the weight average molecular weight is from 200 to 900, the molecular weight distribution thereof is sometimes 1.0. A “weight average molecular weight of from 200 to 900” may also simply be referred to as a “molecular weight of from 200 to 900” in such cases.

In cases in which the first piezoelectric material contains the stabilizer (B), the first piezoelectric material may contain one kind of a stabilizer alone, or may contain two or more kinds thereof.

In cases in which the first piezoelectric material includes the stabilizer (B), the content of the stabilizer (B) is preferably from 0.01 parts by mass to 10 parts by mass, more preferably from 0.01 parts by mass to 5 parts by mass, still more preferably from 0.1 parts by mass to 3 parts by mass, and particularly preferably from 0.5 parts by mass to 2 parts by mass, with respect to 100 parts by mass of the helical chiral polymer (A).

Achieving a content as described above of 0.01 parts by mass or more results in a further improvement in moist heat resistance.

Achieving a content as described above of 10 parts by mass or less results in a deterioration of transparency being further suppressed.

An example of a preferred aspect of the stabilizer (B) includes an aspect in which a stabilizer (B1) including one or more kinds of functional group selected from the group consisting of a carbodiimide group, an epoxy group, and an isocyanate group and having a number-average molecular weight of from 200 to 900, is combined with a stabilizer (B2) including two or more functional groups in a molecule that are one or more kinds of functional group selected from the group consisting of a carbodiimide group, an epoxy group, and an isocyanate group and having a weight average molecular weight of from 1000 to 60,000. The weight average molecular weight of the stabilizer (B1) having a number-average molecular weight of from 200 to 900 is approximately from 200 to 900. The number-average molecular weight and the weight average molecular weight of the stabilizer (B1) are values which are substantially the same as each other.

In cases in which the stabilizer (B1) and the stabilizer (B2) are employed in combination as the stabilizer, a larger amount of stabilizer (B1) is preferably included therein from the viewpoint of improving transparency.

Specifically, with respect to 100 parts by mass of the stabilizer (B1), the amount of stabilizer (B2) is preferably in a range of from 10 parts by mass to 150 parts by mass from the viewpoint of achieving both transparency and moist heat resistance, and is more preferably in a range of from 50 parts by mass to 100 parts by mass.

Specific examples (stabilizers B-1 to B-3) of the stabilizer (B) are described below.

Compound names, commercially available products, and the like for the stabilizers B-1 to B-3 will be described below.

-   -   Stabilizer B-1: The compound name thereof is         bis-2,6-diisopropylphenylcarbodiimide. The weight average         molecular weight thereof (which is simply equivalent to         “molecular weight” in this example) is 363. Examples of the         commercially available products thereof include “STABAXOL I”         manufactured by Rhein Chemie Rheinau Gmbh, and “B2756”         manufactured by Tokyo Chemical Industry Co., Ltd.     -   Stabilizer B-2: The compound name thereof is         poly(4,4′-dicyclohexylmethanecarbodiimide). Examples of the         commercially available products thereof include “CARBODILITE         LA-1” manufactured by Nisshinbo Chemical Inc., as a product         having a weight average molecular weight of about 2000.     -   Stabilizer B-3: The compound name thereof is         poly(1,3,5-triisopropylphenylene-2,4-carbodiimide). Examples of         the commercially available products thereof include “STABAXOL P”         manufactured by Rhein Chemie Rheinau Gmbh, as a product having a         weight average molecular weight of about 3000. There is also         “STABAXOL P400” manufactured by Rhein Chemie Rheinau Gmbh, as a         product having a weight average molecular weight of 20,000.

<Other Components>

The first piezoelectric material may include another component, if necessary.

Examples of such other components include: known resins such as polyvinylidene fluoride, a polyethylene resin, and a polystyrene resin; known inorganic fillers such as silica, hydroxyapatite, and montmorillonite; known crystal nucleating agents such as phthalocyanine; and stabilizers other than the stabilizer (B).

Examples of such inorganic fillers and crystal nucleating agents include components described in the paragraphs 0057 to 0058 of WO 2013/054918.

(Degree of Orientation F)

The degree of orientation F of the first piezoelectric material in the present embodiment is, as described above, from 0.5 up to but not including 1.0, preferably from 0.7 up to but not including 1.0, and more preferably from 0.8 up to but not including 1.0.

Adopting a degree of orientation F of the first piezoelectric material of 0.5 or more results in a large number of molecular chains of the helical chiral polymer (A) (for example, the molecular chains of polylactic acid) being arranged in the stretching direction. This results in a high ratio of oriented crystals being generated, and enables higher piezoelectric properties to be exhibited.

Longitudinal cleavage strength is further improved when the degree of orientation F of the first piezoelectric material is less than 1.0.

(Degree of Crystallinity)

The degree of the crystallinity of the first piezoelectric material in the present embodiment is a value measured by the above X-ray diffraction measurement (wide-angle x-ray diffraction measurement).

The degree of crystallinity of the first piezoelectric material in the present embodiment is preferably from 20% to 80%, more preferably from 25% to 70%, and still more preferably from 30% to 60%.

High piezoelectric properties are maintained by adopting a degree of crystallinity of 20% or more. A high transparency is maintained in the first piezoelectric material by adopting a degree of crystallinity of 80% or less.

Adopting a degree of crystallinity of 80% or less facilitates production of the first piezoelectric material, due to whitening or breaking being less likely to occur when, for example, the first piezoelectric material is being produced by stretching a piezoelectric film that serves as raw material therefor. Adopting a degree of crystallinity of 80% or less results in a fiber with high flexibility and suppleness characteristics in cases in which, for example, production is performed by stretching a raw material for the first piezoelectric material (for example, polylactic acid) after melt spinning, thereby enabling the first piezoelectric material to be easily produced.

(Transparency (Internal Haze))

Transparency is not particularly required for the first piezoelectric material in the present embodiment, but the first piezoelectric material may, of course, have transparency.

The transparency of the first piezoelectric material can be evaluated by measuring an internal haze. The internal haze of the first piezoelectric material referred to here refers to a haze obtained by excluding haze caused by the profile of the outer surface of the first piezoelectric material.

When there are requirements for transparency, the internal haze for visible light of the first piezoelectric material is preferably 5% or less, and, from the viewpoint of further improving transparency and longitudinal cleavage strength, is more preferably 2.0% or less, and is still more preferably 1.0% or less. There is no particular lower limit value for the internal haze of the first piezoelectric material and the lower limit value may, for example, be set at 0.01%.

The internal haze of the first piezoelectric material is a value measured for a first piezoelectric material having a thickness of from 0.03 mm to 0.05 mm at 25° C. in accordance with JIS-K7105 by using a haze measuring machine (TC-HIII DPK, manufactured by Tokyo Denshoku Co., Ltd.).

An example of a method of measuring the internal haze of the first piezoelectric material will be described below.

First, a sample 1 consisting of a silicone oil (SHIN-ETSU SILICONE (trademark), product number: KF96-100CS, manufactured by Shin-Etsu Chemical Co., Ltd.) alone sandwiched between two glass sheets is prepared, and the haze (hereinafter referred to as “haze (H2)”) of the sample 1 is measured in the thickness direction.

Then, a sample 2 is prepared by arranging plural strands of the first piezoelectric material uniformly coated on the surface with a silicone oil next to each other without any gaps therebetween, sandwiched between two glass sheets, and the haze (hereinafter referred to as “haze (H3)”) of the sample 2 is measured in the thickness direction.

The internal haze (H1) of the first piezoelectric material is then obtained by finding the difference between the hazes as described in the following Formula. Internal haze(H1)=haze(H3)−haze(H2)

The haze (H2) and the haze (H3) are each measured here using the following apparatus under the following measurement conditions.

Measurement apparatus: HAZE METER TC-HIIIDPK, manufactured by Tokyo Denshoku Co., Ltd.

Sample size: 30 mm in width×30 mm in length

Measurement conditions: based on JIS-K7105

Measurement temperature: room temperature (25° C.)

(Shape and Dimensions of First Piezoelectric Material)

The piezoelectric substrate of the present embodiment includes the elongate first piezoelectric material.

The elongate first piezoelectric material is preferably a piezoelectric material having a fiber shape (yarn-form) configured from a single or plural bundles, or a piezoelectric material having an elongate flat plate shape.

The piezoelectric material having a fiber shape (hereinafter also referred to as “fibrous piezoelectric material”) and the piezoelectric material having an elongate flat plate shape (hereinafter also referred to as “elongate-flat-plate-shaped piezoelectric material”) will be described in sequence below.

—Fibrous Piezoelectric Material—

Examples of the fibrous piezoelectric material include monofilament yarn and multifilament yarn.

Monofilament Yarn

The monofilament yarn preferably has a single yarn fineness of from 3 dtex to 30 dtex, and more preferably from 5 dtex to 20 dtex.

Handling the yarn is difficult in textile preparation processes and weaving processes when the single yarn fineness is less than 3 dtex. However, fusion between yarns readily occurs when the single yarn fineness is more than 30 dtex.

Cost considerations mean that monofilament yarn is preferably obtained by direct spinning and stretching. The monofilament yarn may be a procured yarn.

Multifilament Yarn

The overall fineness of multifilament yarn is preferably from 30 dtex to 600 dtex, and more preferably from 100 dtex to 400 dtex.

For example, both one-step yarns such as a spin-draw yarn, and also two-step yarns obtained by stretching such as those UDY (undrawn yarn), POY (high orientation undrawn yarn), or the like, are employable as the multifilament yarn. The multifilament yarn may be a procured yarn.

ECODEAR® PLA manufactured by Toray Industries, Inc., TERRAMAC® manufactured by Unitika Ltd., and PLASTARCH® manufactured by KURARAY CO., LTD. are employable as commercially available products of polylactic acid-based monofilament yarn and polylactic acid-based multifilament yarn.

The method of producing the fibrous piezoelectric material is not particularly limited, and any known method may be employed for production.

For example, a filament yarn (monofilament yarn or multifilament yarn) may be obtained as the first piezoelectric material by melt-spinning raw material (for example, polylactic acid) and then stretching the material (i.e. a melt-spinning stretching method). After spinning, the ambient temperature of the vicinity of the yarn is preferably maintained in a certain temperature range until cooling and solidification has occurred.

A filament yarn may be obtained as the first piezoelectric material by, for example, further separating fibers from a filament yarn obtained by the melt-spinning stretching method described above.

Cross-Sectional Profile

Various cross-sectional profiles may be employed as the cross-sectional profile of the fibrous piezoelectric material, such as a circular profile, an elliptical profile, a rectangular profile, a cocoon profile, a ribbon profile, a four-leafed profile, a star profile, and an irregular profile for cross-sections perpendicular to the longitudinal direction of the fibrous piezoelectric material.

—Elongate-Flat-Plate-Shaped Piezoelectric Material—

Examples of the elongate-flat-plate-shaped piezoelectric material include an elongate-flat-plate-shaped piezoelectric material (for example, a slit ribbon) obtained by slitting a piezoelectric film produced by a known method or a procured piezoelectric film.

Use of the elongate-flat-plate-shaped piezoelectric material as the first piezoelectric material enables close face-contact to be achieved with the conductor, thereby enabling charge generated by a piezoelectric effect to be efficiently detected as a voltage signal.

The elongate-flat-plate-shaped piezoelectric material (first piezoelectric material) in the present embodiment preferably includes a functional layer arranged on at least one principal face of the first piezoelectric material.

The functional layer may have a single-layer structure or may be a structure configured from two or more layers.

For example, in cases in which there are functional layers arranged on both principal faces of the elongate-flat-plate-shaped piezoelectric material, a functional layer arranged on the principal face on one side (hereinafter referred to as the “front face” for convenience) and a functional layer arranged on the face on the other side (hereinafter referred to as “back face” for convenience) may, independently, each have a single-layer structure or a structure configured from two or more layers.

There are various examples of functional layers that may be employed as the functional layer.

Examples of the functional layer include an adhesion-facilitation layer, a hard coat layer, a refractive index adjustment layer, an antireflection layer, an antiglare layer, a sliding-facilitation layer, an anti-blocking layer, a protective layer, an adhesive layer, an antistatic layer, a heat dissipation layer, an ultraviolet absorbing layer, an anti-Newton ring layer, a light scattering layer, a polarizing layer, a gas barrier layer, a hue adjustment layer, and an electrode layer.

The functional layer may be a layer including two or more layers from out of such layers.

The functional layer may be a layer having two or more of such functions.

In cases in which the functional layers are disposed on both principal faces of the elongate-flat-plate-shaped piezoelectric material, the functional layer arranged on the front face side and the functional layer arranged on the back face side may be the same type of functional layer or different types of functional layer.

Examples of the effects of the functional layer include the effect of filling defects such as die lines and dents in the surface of the elongate-flat-plate-shaped piezoelectric material so as to improve the appearance thereof. In such cases, the smaller the difference between the refractive indices of the elongate-flat-plate-shaped piezoelectric material and the functional layer, the more that reflection is reduced at the interface between the elongate-flat-plate-shaped piezoelectric material and the functional layer, and the greater the improvement in appearance.

The functional layer preferably includes at least one of an adhesion-facilitation layer, a hard coat layer, an antistatic layer, an anti-blocking layer, a protective layer, or an electrode layer. Adopting such an approach further facilitates application to, for example, a piezoelectric device (such as a piezoelectric textile or a piezoelectric fabric), a force sensor, an actuator, or a biodata acquisition device.

The functional layer more preferably includes an electrode layer.

The electrode layer may be provided so as to be in contact with the elongate-flat-plate-shaped piezoelectric material, or may be disposed with a functional layer other than the electrode layer interposed therebetween.

A particularly preferred aspect of the elongate-flat-plate-shaped piezoelectric material (first piezoelectric material) in the present embodiment is an aspect including functional layers provided on both principal faces of the elongate-flat-plate-shaped piezoelectric material, with both of the functional layers including an electrode layer.

In the elongate-flat-plate-shaped piezoelectric material (first piezoelectric material) in the present embodiment, at least one surface layer of a layered body including the first piezoelectric material and the functional layer is preferably an electrode layer. In other words, in the elongate-flat-plate-shaped piezoelectric material (first piezoelectric material) in the present embodiment, preferably at least one out of the surface layer on the front face side or the surface layer of the back face side is an electrode layer (i.e., the electrode layer is preferably exposed).

This thereby enables the conductor (preferably an inner conductor) or the first outer conductor to be more easily connected to the layered body in cases in which the elongate-flat-plate-shaped piezoelectric material is used as one of the configuration elements of, for example, a piezoelectric device (such as a piezoelectric textile or a piezoelectric fabric), a force sensor, an actuator, or a biodata acquisition device. This raises the ease of manufacturing the piezoelectric device (such as a piezoelectric textile or a piezoelectric fabric), the force sensor, the actuator, or the biodata acquisition device.

There is no particular limitation to the material of the functional layer, and examples thereof include: an inorganic substance such as a metal or a metal oxide; an organic substance such as a resin; a composite composition including a resin and fine particles; and the like. Examples of substances that may be employed as such a resin include a cured resin obtained by curing using heat or actinic-radiation energy. In other words, a curable resin may be used as the resin.

Examples of the curable resin include at least one material (curable resin) selected from the group consisting of an acrylic-based compound, a methacrylic-based compound, a vinyl-based compound, an allyl-based compound, a urethane-based compound, an epoxy-based compound, an epoxide-based compound, a glycidyl-based compound, an oxetane-based compound, a melamine-based compound, a cellulose-based compound, an ester-based compound, a silane-based compound, a silicone-based compound, a siloxane-based compound, a silica-acryl hybrid compound, and a silica-epoxy hybrid compound.

Among these, an acrylic-based compound, an epoxy-based compound, and a silane-based compound are more preferred.

Examples of the metal include at least one selected from Al, Si, Ti, V, Cr, Fe, Co, Ni, Cu, Zn, In, Sn, W, Ag, Au, Pd, Pt, Sb, Ta, or Zr, or an alloy thereof.

Examples of the metal oxide include titanium oxide, zirconium oxide, zinc oxide, niobium oxide, antimony oxide, tin oxide, indium oxide, cerium oxide, aluminum oxide, silicon oxide, magnesium oxide, yttrium oxide, ytterbium oxide, tantalum oxide, and at least one composite oxide thereof.

Examples of the fine particles include: fine particles of metal oxides such as those described above; resin fine particles such as fine particles of a fluorine-based resin, a silicone-based resin, a styrenic-based resin, an acrylic-based resin, and the like. Examples also include hollow fine particles configured with internal pores in such fine particles.

From the viewpoint of transparency, the average primary particle diameter of the fine particles is preferably from 1 nm to 500 nm, more preferably from 5 nm to 300 nm, and still more preferably from 10 nm to 200 nm. An average primary particle diameter of 500 nm or less results in suppression of visible light scattering, while an average primary particle diameter of 1 nm or more results in suppression of the secondary aggregation of the fine particles, this being desirable to achieve from the viewpoint of maintaining transparency.

The film thickness of the functional layer is not particularly limited, and is preferably in a range of from 0.01 μm to 10 μm.

The above upper limit value to the thickness is more preferably 6 μm or less, and still more preferably 3 μm or less. The lower limit value thereof is more preferably 0.01 μm or more, and still more preferably 0.02 μm or more.

The above thickness represents the thickness of the entire multilayer film in cases in which the functional layer is a multilayer film configured from plural functional layers. There may be a functional layer on each face of the elongate-flat-plate-shaped piezoelectric material. The refractive indices of the functional layers may be values different from each other.

There are no particular limitations to the method of producing the elongate-flat-plate-shaped piezoelectric material, and the elongate-flat-plate-shaped piezoelectric material may be produced by a known method.

For example, a method to produce a first piezoelectric material from a piezoelectric film is to mold raw material (for example, polylactic acid) into a film-form to obtain an unstretched film, to stretch and crystallize the obtained unstretched film, and then to slit the obtained piezoelectric film.

“Slitting” here means cutting the piezoelectric film is cut into an elongated shape.

Either the stretching or the crystallization may be performed first. A method may also be adopted in which the unstretched film is sequentially subjected to preliminary crystallization, then stretching, and then crystallization (annealing). Such stretching may be monoaxial stretching or biaxial stretching. In cases in which biaxial stretching is performed, a higher stretching ratio is preferably set in one direction (the principal stretching direction).

The method for producing the piezoelectric film may be performed with appropriate reference to known literature such as Japanese Patent No. 4934235, WO 2010/104196, WO 2013/054918, and WO 2013/089148.

<Second Piezoelectric Material>

The piezoelectric substrate of the first embodiment may include an elongate second piezoelectric material.

The second piezoelectric material preferably has characteristics similar to those of the first piezoelectric material.

In other words, the second piezoelectric material preferably includes an optically active helical chiral polymer (A), a lengthwise direction of the second piezoelectric material and a principal orientation direction of the helical chiral polymer (A) included in the second piezoelectric material are substantially parallel to each other, and a degree of orientation F of the second piezoelectric material, determined from X-ray diffraction measurement by the above Formula (b), is in a range of from 0.5 up to but not including 1.0.

The second piezoelectric material also preferably has characteristics similar to those of the first piezoelectric material for characteristics other than the above.

However, the winding directions of the first piezoelectric material and the second piezoelectric material, and the chiralities of the helical chiral polymers (A) included in the first piezoelectric material and the second piezoelectric material may be appropriately selected according to the aspect of the piezoelectric substrate from the viewpoint of better exhibiting the effects of the present embodiment.

Examples of preferred combinations of the winding directions of the first piezoelectric material and the second piezoelectric material and the chiralities of the helical chiral polymers (A) included in the first piezoelectric material and the second piezoelectric material are as described above in the specific aspects.

The second piezoelectric material may have characteristics different from those of the first piezoelectric material.

<First Insulator>

The piezoelectric substrate of the first embodiment may further include a first insulator.

The first insulator is preferably helically wound around the outer peripheral surface of the inner conductor.

In such cases, the first insulator may be arranged at the opposite side from the inner conductor as viewed from the first piezoelectric material, or may be interposed between the inner conductor and the first piezoelectric material.

The winding direction of the first insulator may be the same direction as the winding direction of the first piezoelectric material or a different direction therefrom.

This is advantages particularly in cases in which the piezoelectric substrate of the first embodiment includes a first outer conductor, since further including the first insulator in the piezoelectric substrate according to the first embodiment makes it easier to suppress the occurrence of an electrical short circuit between the inner conductor and the outer conductor when the piezoelectric substrate undergoes bending deformation.

The first insulator is not particularly limited, and examples thereof include a vinyl chloride resin, a polyethylene resin, a polypropylene resin, an ethylene-tetrafluoroethylene copolymer (ETFE), a tetrafluoroethylene-hexafluoropropylene copolymer (FEP), a tetrafluoroethylene resin (PTFE), a tetrafluoroethylene-perfluoropropylvinylether copolymer (PFA), a fluororubber, a polyester resin, a polyimide resin, a polyamide resin, a polyethylene terephthalate resin (PET), and a rubber (including an elastomer).

The shape of the first insulator is preferably an elongate shape from the viewpoint of winding around the conductor.

<Second Insulator>

The piezoelectric substrate of the present embodiment may, in cases in which a first outer conductor is provided at an outer periphery thereof, further include a second insulator provided at the outer periphery of the first outer conductor.

Adopting such an approach enables the inner conductor configuring the signal line to be electrostatically shielded, and suppresses voltage fluctuations in the conductor (preferably an inner conductor) due to the effects of external static electricity.

The second insulator is not particularly limited, and examples thereof include the materials described in the examples of the first insulator.

The shape of the second insulator is not particularly limited, and any shape capable of covering at least a portion of the first outer conductor may be adopted therefor.

(First Outer Conductor)

The piezoelectric substrate of the present embodiment preferably further includes a first outer conductor at an outer periphery.

The first outer conductor in the present embodiment is preferably a ground conductor.

The ground conductor refers to, for example, a conductor paired with the conductor (preferably a signal line conductor) when a signal is being detected.

The material of the ground conductor is not particularly limited, and main examples thereof include the following materials according to the cross-sectional profile thereof.

For example, materials that may be used as the material of a ground conductor having a rectangular cross-section include a copper foil ribbon obtained by rolling a copper wire of a circular cross-section so as to process the copper wire into a flat plate shape, an A1 foil ribbon, and the like.

For example, materials that may be used as the material of a ground conductor having a circular cross-section include a copper wire, an aluminum wire, an SUS wire, a metal wire covered with an insulating layer, a carbon fiber, a resin fiber integrated together with a carbon fiber, and a tinsel wire obtained by spirally winding a copper foil around a fiber.

A material obtained by coating an organic conductive material with an insulating material may be used as the material of the ground conductor.

The ground conductor is preferably arranged to wrap around the conductor (preferably a signal line conductor) and the first piezoelectric material so as to avoid short circuiting with the signal line conductor.

A method of wrapping such a signal line conductor may be a wrapping method selected from a method of helically winding a copper foil or the like, a method of making a copper wire or the like into a cylindrical braid and then wrapping such a signal line conductor therein, or the like.

The method of wrapping the signal line conductor is not limited to these methods. Wrapping the signal line conductor enables electrostatic shielding to be performed, and enables voltage fluctuations in the signal line conductor due to the effects of external static electricity to be prevented.

A preferable aspect is also an arrangement of the ground conductor so as to be arranged by wrapping in a cylindrical shape so as to enclose a minimum basic configuration unit (i.e., the conductor and the first piezoelectric material) of the piezoelectric substrate of the present embodiment.

Various cross-sectional profiles may be employed as the cross-sectional profile of the ground conductor, such as a circular profile, an elliptical profile, a rectangular profile, and an irregular profile. In particular, a rectangular cross-section enables close contact to be achieved by flat-faces with the conductor (preferably a signal line conductor), the first piezoelectric material, and, according to circumstances, with the first insulator, the second piezoelectric material, or the like, thereby enabling charge generated by a piezoelectric effect to be efficiently detected as a voltage signal.

<Adhesive Agent to Form Adhesive Layer>

The piezoelectric substrate of the present embodiment preferably includes an adhesive layer between the conductor and the first piezoelectric material.

The adhesive agent to form the adhesive layer is used in order to mechanically integrate the conductor and the first piezoelectric material together or to maintain an inter-electrode distance (between the conductor and the outer conductor) in cases in which the piezoelectric substrate includes an outer conductor.

Providing the adhesive layer between the conductor and the first piezoelectric material inhibits the relative position of the conductor and the first piezoelectric material from shifting when tension has been applied to the piezoelectric substrate of the present embodiment, thereby facilitating application of tension to the first piezoelectric material. This accordingly enables a voltage output proportional to the tension to be effectively detected from the conductor (preferably a signal line conductor). As a result, piezoelectric sensitivity and piezoelectric output stability are further improved. Providing the adhesive layer results in a further increase in the absolute value of the amount of generated charge per unit tensile force.

However, since suppleness is maintained after processing a piezoelectric substrate lacking an adhesive layer between a conductor and a first piezoelectric material into a piezoelectric fiber, this approach results in a favorable feeling of fit when employed in a wearable sensor or the like.

The following materials may be used as the material of the adhesive agent to form the adhesive layer.

Examples of adhesive agents that may be used therefor include an epoxy-based adhesive agent, a urethane-based adhesive agent, a vinyl acetate resin-based emulsion type adhesive agent, an (EVA)-based emulsion type adhesive agent, an acrylic resin-based emulsion type adhesive agent, a styrene-butadiene rubber-based latex type adhesive agent, a silicone resin-based adhesive agent, an α-olefin (isobutene-maleic anhydride resin)-based adhesive agent, a vinyl chloride resin-based solvent type adhesive agent, a rubber-based adhesive agent, an elastic adhesive agent, a chloroprene rubber-based solvent type adhesive agent, a nitrile rubber-based solvent type adhesive agent or the like, and a cyanoacrylate-based adhesive agent or the like.

—Elastic Modulus—

The adhesive agent in the present embodiment preferably has an elastic modulus after bonding that is either equivalent to, or greater than, that of the first piezoelectric material. If the material used has an elastic modulus lower than the elastic modulus of the first piezoelectric material, then strain (piezoelectric strain) caused by tension that has been applied to the piezoelectric substrate of the present embodiment would be attenuated by the adhesive agent portion, decreasing the transfer efficiency of strain to the first piezoelectric material. This results in the sensitivity of a sensor being prone to decrease in cases in which the piezoelectric substrate of the present embodiment is applied to a sensor, for example.

—Thickness—

The thickness at sites bonded by the adhesive agent in the present embodiment is preferably as thin as possible within a range in which there are no voids between the bonding targets and bonding strength does not decrease. Decreasing the thickness at the bonded sites makes it less likely that strain caused by tension that has been applied to the piezoelectric substrate is attenuated by the adhesive agent portion, and the strain on the first piezoelectric material is efficiently decreased. This results in the sensitivity of a sensor being improved in cases in which the piezoelectric substrate of the present embodiment is applied to a sensor, for example.

—Method of Applying Adhesive Agent—

The method of applying the adhesive agent is not particularly limited, and the following two methods are primarily used therefor.

Method of Interposing Adhesive Agent and Performing Bonding after Processing

Examples thereof include a method in which: a conductor (preferably a signal line conductor) and a first piezoelectric material are arranged; the signal line conductor and a ground conductor are processed and arranged; and then, after this has been completed, an adhesive agent is interposed and adhered at an interface between the conductor and the first piezoelectric material by a method such as dip coating, impregnation, or the like.

In the above method, as well as bonding the conductor and the first piezoelectric material to each other, bonding may also be performed between each member that has, if necessary, been included in the piezoelectric substrate of the present embodiment.

Method of Interposing Uncured Adhesive Agent Before Processing, and Performing Bonding after Processing

Examples thereof include a method in which a photo-curable adhesive agent, a thermosetting adhesive agent, a thermoplastic adhesive agent, or the like is coated in advance onto a surface of a first piezoelectric material using a gravure coater, a dip coater, or the like, and then dried. Then after completing arrangement of a conductor and the first piezoelectric material, the adhesive agent is then cured by ultraviolet irradiation or heat so as to bond an interface between the conductor and the first piezoelectric material.

In the above method, as well as bonding the conductor and the first piezoelectric material to each other, bonding may also be performed between each member that has, if necessary, been included in the piezoelectric substrate of the present embodiment.

Using the above method enables processing to be performed by dry processes, after the adhesive agent has been coated and dried, thereby facilitating processing or facilitating formation of a uniform film thickness. This results in characteristically small variations in sensor sensitivity and the like.

<Method of Producing Piezoelectric Substrate>

The method of producing the piezoelectric substrate of the present embodiment is not particularly limited, and the piezoelectric substrate may be produced, for example, by preparing a first piezoelectric material and helically winding the first piezoelectric material around a separately prepared conductor (preferably a signal line conductor) in one direction.

The first piezoelectric material may also be produced by a known method and may also be procured.

In cases in which the piezoelectric substrate of the present embodiment includes, if necessary, a second piezoelectric material and a first insulator, such a piezoelectric substrate may be produced in accordance with the methods for helically winding the first piezoelectric material.

However, the directions of winding the first piezoelectric material and the second piezoelectric material, and the chiralities of the helical chiral polymers (A) included in the first piezoelectric material and the second piezoelectric material, are preferably selected in accordance with the aspects of the piezoelectric substrate described above.

In cases in which the piezoelectric substrate of the present embodiment includes a first outer conductor (for example, a ground conductor), such a piezoelectric substrate may be produced by arranging the first outer conductor using the above methods or a known method.

If necessary, the conductor and the first piezoelectric material, and each member included in the piezoelectric substrate of the present embodiment, may be stuck together by interposing an adhesive agent therebetween using, for example, the method described above.

In the piezoelectric substrate of the present embodiment, due to the application of tensile force, shearing strain proportional to the tensile force is applied to a helical chiral (A) and detected as a voltage signal (charge signal) from the conductor.

Second Embodiment

A sensor module 200 of a second embodiment is described below, with reference to FIG. 5A to FIG. 5C.

In the second embodiment, an attachment structure 100 thereof, and the placement of the first member 220 and the second member 222 thereof, are the same at those of the first embodiment, however, the method of fixing the piezoelectric substrate 10 is different thereto. The structure of a piezoelectric substrate 10 is the same as that of the first embodiment and so description thereof will be omitted. The same reference signs are appended to the same configuration as that of the first embodiment.

FIG. 5A is a perspective view of the sensor module 200 according to the present embodiment. The sensor module 200 of the present embodiment is cuboidal shaped in external appearance, and includes a first member 220 and a second member 222 that the first member 220 is placed on.

FIG. 5B is a plan view cross-section (cross-section along a plane parallel to a principal face) of the sensor module 200 sectioned along a boundary at the axis of the piezoelectric substrate 10 (straight line C), and is a cross-section taken along line P2-P2′ of FIG. 5A. As illustrated in this figure, the piezoelectric substrate 10 is a cable-shaped piezoelectric substrate 10 extending in a straight line from one end to the other end in a lengthwise direction. A layer of adhesive agent (referred to below as “adhesive layer 230”) is formed on a lower face of the piezoelectric substrate 10 to fix the piezoelectric substrate 10 to the second member 222.

FIG. 5C is a side view cross-section (cross-section taken along the thickness direction) of the sensor module 200 sectioned along a boundary at the axis of the piezoelectric substrate 10 (straight line C), and is a cross-section taken along line S2-S2′ of FIG. 5A. As illustrated in this figure, the sensor module 200 of the present embodiment is formed such that the cable-shaped piezoelectric substrate 10 is sandwiched between the first member 220 and the second member 222. The adhesive layer 230 is then formed to the lower face of the piezoelectric substrate 10.

In the present embodiment, the first member 220 correspond to the press section 20A, and the adhesive layer 230 and the second member 222 correspond to the base section 20B.

The materials that may be employed here for the first member 220 and the second member 222 are the same as those of the first embodiment.

Forming the present embodiment such that the thickness da and the storage modulus E′a of the first member 220, and the thickness db and the storage modulus E′b of the adhesive layer 230 and the second member 222, satisfy the relationship Equation (a) given above, enables provision of the sensor module 200 in which shock and vibration are not prone to be transmitted from the base section 20B side, and in which pressure is readily transmitted from the press section 20A.

(Method of Producing the Sensor Module)

In order to produce the sensor module 200 of the present embodiment, first an adhesive agent is coated onto an upper face of the second member 222, along the layout locations for the piezoelectric substrate 10. The piezoelectric substrate 10 is then laid onto the portions coated with the adhesive agent and fixed thereto. The first member 220 is then placed on top of the second member 222 and the piezoelectric substrate 10 and fixed thereto, so as to thereby form the sensor module 200.

The composition and the like of the adhesive layer 230 is similar to that of the adhesive agent for forming the adhesive layer of the piezoelectric substrate 10 described above. Namely, the following materials may be used as the material of the adhesive agent employed to fix the piezoelectric substrate 10 and the second member 222 together.

Examples of adhesive agents that may be used therefor include an epoxy-based adhesive agent, a urethane-based adhesive agent, a vinyl acetate resin-based emulsion type adhesive agent, an (EVA)-based emulsion type adhesive agent, an acrylic resin-based emulsion type adhesive agent, a styrene-butadiene rubber-based latex type adhesive agent, a silicone resin-based adhesive agent, an α-olefin (isobutene-maleic anhydride resin)-based adhesive agent, a vinyl chloride resin-based solvent type adhesive agent, a rubber-based adhesive agent, an elastic adhesive agent, a chloroprene rubber-based solvent type adhesive agent, a nitrile rubber-based solvent type adhesive agent or the like, and a cyanoacrylate-based adhesive agent or the like.

These adhesive agents are preferably selected to match the substance of the covering member of the piezoelectric substrate 10, and to match the substance of the second member 222.

Third Embodiment

A sensor module 200 of a third embodiment will be described below, with reference to FIG. 6A to FIG. 6C.

In the third embodiment, the attachment structure 100 and the placement of the first member 220 and the second member 222 thereof, are the same as those of the second embodiment, however, the forming location where the adhesive layer 230 is formed differs from that of the second embodiment. The structure of the piezoelectric substrate 10 is the same as that of the first embodiment, and so description thereof is omitted. The same reference signs are appended to the same configuration as that of the first embodiment.

FIG. 6A is a perspective view of the sensor module 200 of the present embodiment. The sensor module 200 of the present embodiment is cuboidal shaped in external appearance, and includes a first member 220 and a second member 222 that the first member 220 is placed on.

FIG. 6B is plan view cross-section (cross-section of a plane parallel to a principal face) of the sensor module 200 sectioned along a boundary at the axis of the piezoelectric substrate 10 (straight line C), and is a cross-section taken along line P3-P3′ of FIG. 6A. As illustrated in this figure, the piezoelectric substrate 10 is a cable-shaped piezoelectric substrate 10 extending in a straight line from one end to the other end in a lengthwise direction. Although not illustrated in FIG. 6B, an adhesive layer 230 is formed on an upper face of the piezoelectric substrate 10 to fix the piezoelectric substrate 10 to the first member 220.

FIG. 6C is a side view cross-section (cross-section in the thickness direction) of the sensor module 200 sectioned along a boundary at the axis of the piezoelectric substrate 10 (straight line C), and is a cross-section taken along line S3-S3′ of FIG. 6A. As illustrated in this figure, the sensor module 200 of the present embodiment is formed such that the cable-shaped piezoelectric substrate 10 is sandwiched between the first member 220 and the second member 222. The adhesive layer 230 is formed on an upper face of the piezoelectric substrate 10.

In the present embodiment described above, the first member 220 and the adhesive layer 230 correspond to the press section 20A, and the second member 222 corresponds to the base section 20B.

The materials that may be employed for the first member 220 and the second member 222 are the same as those of the first embodiment.

Forming the present embodiment such that the thickness da and the storage modulus E′a of the first member 220 and the adhesive layer 230, and the thickness db and the storage modulus E′b of the second member 222, satisfy the relationship Equation (a) given above, enables provision of the sensor module 200 in which shock and vibration are not prone to be transmitted from the base section 20B side, and in which pressure is readily transmitted from the press section 20A.

(Method of Producing the Sensor Module)

In order to produce the sensor module 200 of the present embodiment, first an adhesive agent is coated onto a lower face of the first member 220, along the layout locations for the piezoelectric substrate 10. The piezoelectric substrate 10 is then laid onto the portions coated with the adhesive agent and fixed thereto. The first member 220 and the piezoelectric substrate 10 are then placed on top of the second member 222 and fixed thereto, so as to thereby form the sensor module 200.

The composition and the like of the adhesive layer 230 is the same as described above.

Fourth Embodiment

A sensor module 200 of a fourth embodiment is described below, with reference to FIG. 7A to FIG. 7C.

In the fourth embodiment, an attachment structure 100 thereof is the same at that of the first embodiment, but a press section 20A and a base section 20B configuring the sensor module 200 differ therefrom in that an integrated configuration is adopted therefor. The structure of a piezoelectric substrate 10 is the same as that of the first embodiment, and therefore, description thereof will be omitted. The same reference signs are appended to configurations that are the same as those of the first embodiment.

FIG. 7A to FIG. 7C illustrate a sensor module 200 provided with the attachment structure 100 of the present embodiment. In the present embodiment, a main body 210 is configured by the press section 20A pressed by contact, and the base section 20B provided adjacent to the piezoelectric substrate 10 on the opposite side from the press section 20A, with the press section 20A and the base section 20B being integrated together.

FIG. 7A is a perspective view of the sensor module 200 of the present embodiment. The sensor module 200 of the present embodiment is cuboidal shaped in external appearance, and is formed from the main body 210 in which the press section 20A and the base section 20B are integrated together.

FIG. 7B is a plan view cross-section (cross-section of a plane parallel to a principal face) of the sensor module 200 sectioned along a boundary at the axis of the piezoelectric substrate 10 (straight line C), and is a cross-section taken along line P4-P4′ of FIG. 7A. As illustrated in this figure, the piezoelectric substrate 10 is a cable-shaped piezoelectric substrate 10 extending in a straight line from one end to the other end in a lengthwise direction.

FIG. 7C is a side view cross-section (cross-section taken along the thickness direction) of the sensor module 200 sectioned along a boundary at the axis of the piezoelectric substrate 10 (straight line C), and is a cross-section taken along line S4-S4′ of FIG. 7A. As illustrated in this figure, the sensor module 200 of the present embodiment is formed by embedding the cable-shaped piezoelectric substrate 10 in the main body 210.

In the sensor module 200 here of the present embodiment, a pressure-applied face 21 side of the boundary at the piezoelectric substrate 10 configures the press section 20A, and the opposite side thereof to the pressure-applied face 21 side configures the base section 20B.

The following materials may be employed as the main body 210.

Materials that may be employed therefor include: an organic gel; an inorganic gel; an elastomer such as a silicone elastomer, an acrylic elastomer, a urethane elastomer, a fluorine-based elastomer, a perfluoro elastomer, an isoprene rubber, a butadiene rubber, a styrene-butadiene rubber, natural rubber, a chloroprene rubber, a nitrile rubber, a butyl rubber, an ethylene propylene rubber, and an epichlorohydrin rubber; a polymer material such as polyethylene, polypropylene, polystyrene, polyvinylchloride, polyethylene terephthalate, a polycarbonate, polyamide, a polyvinyl alcohol, polyacetal, a polyimide, polyester, a cyclic polyolefin, a styrene-acrylonitrile copolymer, a styrene-butadiene-acrylonitrile copolymer, an ethylene-vinyl acetate copolymer, a methacrylic-styrene copolymer, an acrylic resin, a fluororesin, a urethane resin, a phenol resin, a urea resin, an epoxy resin, a cellulose-based resin, an unsaturated polyester resin, a melamine resin, a silicone resin, a copolymer or alloy thereof, a modified product thereof, and a foamed product (foam) thereof; a wood; and the like.

The present embodiment is also formed such that the above relationship Equation (a) is satisfied. However, the materials employed are the same for the press section 20A and the base section 20B, and the thicknesses d are the only variable elements. Namely, in the present embodiment, the above relationship Equation (a) is satisfied by setting the thickness db of the base section 20B thicker than the thickness da of the press section 20A. Forming such that the above relationship Equation (a) is satisfied enables provision of the sensor module 200 in which shock and vibration are not prone to be transmitted from the base section 20B side, and pressure is readily transmitted from the press section 20A.

(Method of Producing the Sensor Module)

In order to produce the sensor module 200 of the present embodiment, there are two methods for embedding the piezoelectric substrate 10: a method in which embedding is performed during molding the main body 210; and a method in which embedding is performed after molding the main body 210.

First, in cases in which embedding is performed during molding the main body 210, the main body 210 is formed so as to surround the piezoelectric substrate 10, by melt-extrusion or by injection molding. In the sensor module 200 formed in such a manner, the piezoelectric substrate 10 embedded inside the main body 210 is fixed to the main body 210. The main body 210 may also be formed by disposing a curable material so as to surround the piezoelectric substrate 10, and then curing the curable material.

Moreover, in cases in which embedding is performed after molding the main body 210, the main body 210 is formed by opening a hole in a side face of the main body 210 after molding, and inserting the piezoelectric substrate 10 therein. Note that for post-insertion of the piezoelectric substrate 10, the piezoelectric substrate 10 is inserted only after an adhesive agent has been poured into the hole for piezoelectric substrate 10 insertion. Alternatively, an adhesive agent is impregnated after the piezoelectric substrate 10 has been inserted. Using an adhesive agent enables movement of the piezoelectric substrate 10 in its axial direction to be prevented in the main body 210.

Fifth Embodiment

A sensor module 200 of a fifth embodiment will be described below, with reference to FIG. 8A to FIG. 8C.

The fifth embodiment is an example of configuring a sensor module with an adhesive layer 230 and a second member 222. The adhesive layer 230 of the present embodiment is configured from an insulator. The structure of the piezoelectric substrate 10 is the same as that of the first embodiment, and so description thereof is omitted. The same reference signs are appended to the same configuration as that of the first embodiment.

FIG. 8A is a perspective view of a sensor module 200 of the present embodiment. The sensor module 200 of the present embodiment includes a cuboidal shaped second member 222, and a piezoelectric substrate 10 wrapped in the adhesive layer 230 and disposed on an upper face of the second member 222.

FIG. 8B is a plan view cross-section (cross-section of a plane parallel to a principal face) of the sensor module 200 sectioned along a boundary at the axis of the piezoelectric substrate 10 (straight line C), and is a cross-section taken along line P5-P5′ of FIG. 8A. As illustrated in this figure, the piezoelectric substrate 10 is a cable-shaped piezoelectric substrate 10 extending in a straight line from one end to the other end in a lengthwise direction. The adhesive layer 230 is provided so as to surround a leading end portion and an outer peripheral portion of the piezoelectric substrate 10.

FIG. 8C is a side view cross-section (cross-section in the thickness direction) of the sensor module 200 sectioned along a boundary at the axis of the piezoelectric substrate 10 (straight line C), and is a cross-section taken along line S5-S5′ of FIG. 8A. As illustrated in this figure, the adhesive layer 230 is provided so as to surround the leading end portion and the outer peripheral portion of the piezoelectric substrate 10. A portion of the adhesive layer 230 below the piezoelectric substrate 10 is in contact with the second member 222. Namely, the piezoelectric substrate 10 is fixed to the second member 222 by the adhesive layer 230.

In the sensor module 200 here of the present embodiment, a press section 20A is configured by the adhesive layer 230 disposed on a pressure-applied face 21 side of a boundary taken along the piezoelectric substrate 10, and a base section 20B is configured by the adhesive layer 230 disposed on the opposite side from the pressure-applied face 21 side and the second member 222.

Forming the present embodiment such that the thickness da and the storage modulus E′a of the adhesive layer 230 disposed on the pressure-applied face 21 side, and the thickness db and the storage modulus E′b of the adhesive layer 230 disposed on the opposite side from the pressure-applied face 21 side and the second member 222, satisfy the relationship Equation (a) given above, enables provision of the sensor module 200 in which shock and vibration are not prone to be transmitted from the base section 20B side, and in which pressure is readily transmitted from the press section 20A.

(Method of Producing the Sensor Module)

In order to produce the sensor module 200 of the present embodiment, for example, an adhesive agent is coated onto an upper face of the second member 222, along the layout locations for the piezoelectric substrate 10. The piezoelectric substrate 10 is then laid onto the portions coated with the adhesive agent. The adhesive layer 230 can then be formed so as to surround the outer peripheral portions of the piezoelectric substrate 10 by coating the adhesive agent so as to cover the piezoelectric substrate 10. Moreover, for example, the adhesive layer 230 may be formed by coating the adhesive agent so as to cover the outer periphery of the piezoelectric substrate 10, and then sticking the coated piezoelectric substrate 10 to the second member 222 before the adhesive agent has cured.

The materials of the adhesive agent surrounding the outer peripheral portions of the piezoelectric substrate 10 are as listed above.

Although in the present embodiment the piezoelectric substrate 10 is covered with the adhesive layer 230, there is no limitation thereto, and present embodiment also encompasses cases in which the piezoelectric substrate 10 is covered in an insulating layer made from resin. Namely, the present embodiment encompasses embodiments in which the press section 20A is configured by an insulator covering the outer periphery of the piezoelectric substrate 10 disposed adjacent to the base section 20B.

Sixth Embodiment

A sensor module 200 of a sixth embodiment will be described below, with reference to FIG. 9A to FIG. 9C.

The sixth embodiment is an example of a sensor module configured by a pressure sensitive adhesive tape 240 and a second member 222. Note that the structure of the piezoelectric substrate 10 is the same as that of the first embodiment, and so description thereof is omitted. The same reference signs are appended to the same configuration as that of the first embodiment.

FIG. 9A is a perspective view of a sensor module 200 of the present embodiment. The sensor module 200 of the present embodiment includes a cuboidal shaped second member 222, and a piezoelectric substrate 10 covered by a pressure sensitive adhesive tape 240 and disposed on an upper face of the second member 222.

FIG. 9B is a plan view cross-section (cross-section of a plane parallel to a principal face) of the sensor module 200 sectioned along a boundary at the axis of the piezoelectric substrate 10 (straight line C), and is a cross-section taken along line P6-P6′ of FIG. 9A. As illustrated in this figure, the piezoelectric substrate 10 is a cable-shaped piezoelectric substrate 10 extending in a straight line from one end to the other end in a lengthwise direction. The pressure sensitive adhesive tape 240 is also provided so as to cover a leading end portion and outer peripheral portion of the piezoelectric substrate 10.

FIG. 9C is a side view cross-section (cross-section in the thickness direction) of the sensor module 200 sectioned along a boundary at the axis of the piezoelectric substrate 10 (straight line C), and is a cross-section taken along line S6-S6′ of FIG. 9A. As illustrated in this figure, the pressure sensitive adhesive tape 240 is provided so as to cover the leading end portion and the outer peripheral portion of the piezoelectric substrate 10. The pressure sensitive adhesive tape 240 is stuck to the second member 222 so as to cover the piezoelectric substrate 10.

In the sensor module 200 of the present embodiment, the press section 20A is configured by the pressure sensitive adhesive tape 240 on a pressure-applied face 21 side of a boundary taken along the piezoelectric substrate 10, and a base section 20B is configured by the second member 222 on the opposite side thereof to the pressure-applied face 21 side.

Forming the present embodiment such that the thickness da and the storage modulus E′a of the pressure sensitive adhesive tape 240 on the pressure-applied face 21 side, and the thickness db and the storage modulus E′b of the second member 222, satisfy the relationship Equation (a) given above, enables provision of the sensor module 200 in which shock and vibration are not prone to be transmitted from the base section 20B side, and in which pressure is readily transmitted from the press section 20A.

(Method of Producing the Sensor Module)

In order to produce the sensor module 200 of the present embodiment, the piezoelectric substrate 10 is first placed in a straight line along the upper face of the second member 222. The pressure sensitive adhesive tape 240 is then stuck on so as to cover the piezoelectric substrate 10.

Seventh to Ninth Embodiments

A sensor module 200 of a seventh to ninth embodiments will be described below, with reference to FIG. 10A to FIG. 10C. The seventh to ninth embodiments are embodiments in which the placement of the piezoelectric substrate 10 is changed. Other configuration, and the structure of the piezoelectric substrate 10 are the same as those of the first embodiment, and so description thereof is omitted. The same reference signs are appended to the same configuration as that of the first embodiment.

As illustrated in FIG. 10A, in the seventh embodiment a piezoelectric substrate 10 is laid on the pressure-applied face 21 in a wavy shape. This enables fluctuations in sensitivity due to position on the pressure-applied face 21 to be suppressed compared to cases in which the piezoelectric substrate 10 is laid in a straight line.

As illustrated in FIG. 10B, in the eighth embodiment a piezoelectric substrate 10 is laid on the pressure-applied face 21 in a flat-spiral shape. This enables fluctuations in sensitivity due to position on the pressure-applied face 21 to be suppressed compared to cases in which the piezoelectric substrate 10 is laid in a straight line.

As illustrated in FIG. 10C, in the ninth embodiment plural lines of piezoelectric substrate 10 are laid on the pressure-applied face 21 parallel to each other. This enables fluctuations in sensitivity due to position on the pressure-applied face 21 to be suppressed compared to cases in which the piezoelectric substrate 10 is laid in a straight line. Moreover, separately detecting with each of the plural individual lines of piezoelectric substrate 10 enables the identification of the position pressure is applied to.

(Moving Body)

The attachment structure 100 and the sensor module 200 of each of the embodiments may be applied to a moving body 250. Examples of the moving body 250 include vehicles (for example four-wheel vehicles, two-wheel vehicles, etc.), trains, cargo trains, ships, aircraft, bicycles, trollies, caster trucks, robots, actuators, and the like. A specific aspect will be described in which a trolley is as an example of the moving body 250.

<Specific Aspect A>

A moving body 250 of a specific aspect is a moving body 250 including a shock absorbing member 260 disposed at least at a moving direction side of the moving body 250. The moving body 250 includes an attachment structure 100, with the shock absorbing member 260 serving as a base section 20B, and a press section 20A and a piezoelectric substrate 10 of the attachment structure 100 mounted to the shock absorbing member 260.

Examples of the shock absorbing member 260 correspond, for example, to a bumper in the case of a trolley. As illustrated in FIG. 11A, in the present aspect, the bumper itself is the shock absorbing member 260 configuring the base section 20B. A sensor function is achieved by mounting the press section 20A and the piezoelectric substrate 10 to the bumper.

<Specific Aspect B>

A moving body 250 of another specific aspect has a base section 20B of a sensor module 200 of each of the embodiments described above attached on the moving direction (i.e. an arrow M direction) side of the moving body 250. For example in the case of a trolley, as illustrated in FIG. 11B, the sensor module 200 of each of the embodiments described above may be mounted to a moving direction (i.e. arrow M direction) front face. The present aspect enables the sensor module 200 to be post-fitted to an existing moving body 250.

Although in the two specific aspects described above, the attachment structure 100 or the sensor module 200 is provided to a side face on the moving direction (i.e. arrow M direction) side, there is no limitation thereto. For example, the attachment structure 100 or the sensor module 200 may be provided so as to surround a periphery of the moving body 250.

(Protection Body)

Moreover, the attachment structure 100 and the sensor module 200 of each of the embodiments may applied to a protection body 280. Examples of the protection body 280 include protectors, supporters, shoes, clothes, caps, helmets, vehicle seats and seatbelts, and the like. Description follows of a specific aspect in which a protector serves as the protection body 280.

<Specific Aspect A>

A protection body 280 of a specific aspect is a protection body 280 including a contact member 290 on a contact portion that makes external contact. The protection body 280 includes an attachment structure 100, the contact member 290 serves as the base section 20B, and the press section 20A and the piezoelectric substrate 10 of the attachment structure 100 are mounted to the contact member 290.

The contact member 290 here corresponds, for example, to a guard portion in the case of a protector. As illustrated in FIG. 12A, in the present aspect, the guard portion that is the contact member 290 configures the base section 20B. A sensor function is achieved by mounting the press section 20A and the piezoelectric substrate 10 to the guard portion.

<Specific Aspect B>

In a protection body 280 of another specific aspect a sensor module 200 is formed so as to conform to the shape of an object to be protected. For example, in cases in which a protector is mounted to the knee of a person, as illustrated in FIG. 12B, the sensor module 200 itself is formed so as to conform to the shape of the knee.

Summary of Embodiments

In each of the embodiments, when pressure is applied to the press section 20A by contact with an object (including shock due to impact and vibration due to repeated contact), the piezoelectric substrate 10 functions as a pressure sensor (including an impact sensor, vibration sensor) by outputting a signal. When this occurs in the press section 20A, not only, obviously, can pressure be detected at the pressure-applied face 21, but also at faces adjoining the pressure-applied face 21, namely at side faces of the press section 20A. Namely, each of the embodiments is able to detect pressure by changes in tension acting in the axial direction of the piezoelectric substrate 10.

Each of the embodiments is formed such that when the base section 20B has been pressed, such force is not readily transmitted to the piezoelectric substrate 10.

Forming each of the embodiments such that da/E′a<db/E′b is satisfied, as relationship Equation (a), enables provision of the sensor module 200 in which shock and vibration are not prone to be transmitted from the base section 20B side, and in which pressure is readily transmitted from the press section 20A. Note that when logarithms are taken of da/E′a and db/E′b and a difference log (db/E′b)−log (da/E′a) found therefrom, this preferably lies in a range of from 1 to 10. Forming each of the embodiments such that log (db/E′b)−log (da/E′a) is in a range of from 1 to 10 enables provision of the sensor module 200 in which shock and vibration are not prone to be transmitted from the base section 20B side, and in which pressure is readily transmitted from the press section 20A.

Moreover, in cases in which the attachment structure 100 and the sensor module 200 of each of the embodiments is applied to the moving body 250 and the protection body 280, due to not being greatly affected by pressure (shock, vibration) generated on the mounting target side during movement and the like, the sensitivity can be raised to external contact of people, objects, and the like.

The sensor module 200 of the embodiments may also be configured partly or wholly by curved faces. For example, the first member 220 may be a molded body including a curved face. Moreover, for example, the second member 222 may have a shape that conforms to a shape of the mounting target.

Each of the embodiments may also be appropriately combined with other embodiments, and various aspects may be realized within a range not departing from the spirit in the invention.

EXAMPLES

The invention will be more specifically described below by way of Examples. As long as the invention does not depart from the spirit thereof, the invention is not limited to the following Examples.

<Production of Ribbon-Shaped Piezoelectric Material (Slit Ribbon)>

1.0 part by mass of a stabilizer was added to 100 parts by mass of a polylactic acid (trade name: INGEO′ BIOPOLYMER, brand name: 4032D) manufactured by NatureWorks LLC as a helical chiral polymer (A) and dry-blended to produce a raw material (the stabilizer was a mixture of STABAXOL P400 (10 parts by mass) manufactured by Rhein Chemie Rheinau Gmbh, STABAXOL I (70 parts by mass) manufactured by Rhein Chemie Rheinau Gmbh, and CARBODILITE LA-1 (20 parts by mass) manufactured by Nisshinbo Chemical Inc.).

The produced raw material was put in a hopper of an extrusion molding machine, extruded from a T-die while being heated at 210° C., and brought into contact with a cast roll at 50° C. for 0.3 minute so as to form a film of a pre-crystallized sheet having a thickness of 150 μm (pre-crystallization process). The degree of crystallinity of the pre-crystallized sheet was measured to be 6%.

The obtained pre-crystallized sheet was then subjected to uniaxial stretching in a roll-to-roll process while being heated to 70° C., with 3.5-fold stretching performed in the MD direction at a 10 m/min initial line speed in stretching (stretching process). The thickness of the obtained film was 49.2 μm.

The uniaxially stretched film was then subjected to annealing treatment in a roll-to-roll process by being brought into contact with a roll heated to 145° C. for 15 seconds, thereby being, and then being rapidly quenched to produce a piezoelectric film (annealing treatment process).

The piezoelectric film was then further processed using a slitter, so as to thereby be slit to a width of 0.6 mm with the slitting direction and the stretch direction of the piezoelectric film substantially parallel to each other. A slit ribbon having a width of 0.6 mm and a thickness of 49.2 μm was thereby obtained as a ribbon-shaped piezoelectric material. The obtained slit ribbon had a rectangular cross-section profile.

<Production of Sensor Module>

A cable-shaped piezoelectric substrate 10 was produced from the ribbon-shaped piezoelectric material described above.

Example 1 and Comparative Example 1

Cuboidal shaped members corresponding to the first member 220 and the second member 222 were prepared, and a sample of the sensor module 200 was produced by sandwiching the piezoelectric substrate 10 produced as described above at the center between these two members. As Example 1, a sensor module 200 was produced using rubber for the first member 220 and using urethane foam for the second member 222. As Comparative Example 1, a sensor module 200 was produced using urethane foam for both the first member 220 and the second member 222. The piezoelectric substrate 10 was not adhered in the sensor modules 200 of both Example 1 and Comparative Example 1. In both the above Example 1 and Comparative Example 1, the first member 220 corresponds to the press section 20A, and the second member 222 correspond to the base section 20B.

<Measurement of Storage Modulus E Values>

A dynamic viscoelastic analyzer (DVA-220, manufactured by IT Keisoku Seigyo Co., Ltd.) was used on the members employed as the first member 220 and the second member 222 of Example 1 and Comparative Example 1, and the values of storage modulus E found by dynamic viscoelastic analysis at a frequency of 10 Hz and 25° C.

<Sensitivity Measurement>

The output values were measured for Example 1 and Comparative Example 1 when a shock had been imparted to the first member 220 and the second member 222. As illustrated in FIG. 13 , a testing device 300 employed for measurements imparted a shock to the sensor module 200 placed on a bottom face by dropping a cylindrical bar shaped weight 310 from a height of 200 mm above a measurement face. The cylindrical bar shaped weight had an external diameter of 15 mm, a height of 62 mm, and a weight of 95 g. A tubular shaped guide 320, and a support 330 to support the guide 320 were provided in the testing device 300 so that the weight 310 was dropped onto the measurement face at a location corresponding to the layout location of the piezoelectric substrate 10.

The voltage values output from the piezoelectric substrate 10 were measured using the above device when a shock was imparted with the first member 220 as the measurement face, and the voltage values output from the piezoelectric substrate 10 were measured when a shock was imparted with the second member 222 as the measurement face.

The output results for Example 1 are illustrated in FIG. 14A, and the output results for Comparative Example 1 are illustrated in FIG. 14B. Face A in the legends of FIG. 14A and FIG. 14B indicates when the first member 220 was the measurement face, and face B in the legends indicates when the second member 222 was the measurement face.

The following Table 1 summarizes the configurations and evaluation results of Example 1 and Comparative Example 1.

The notation “(value a)E(value b)” in the table represents “(value a)>10^((value b))”. For example, the notation “5.0E−08” represents 5.0×10⁻⁸.

TABLE 1 Comparative Example 1 Example 1 First Substance Rubber Urethane foam member Width × length 100 mm × 100 mm 100 mm × 100 mm (Face Thickness d 1.6 mm 5.0 mm A) Storage 3.2E+07 Pa 5.2E+05 Pa modulus E′ Thickness 5.0E−08 mm/Pa 9.6E−06 mm/Pa d/Storage modulus E′ Second Substance Urethane foam Urethane foam member Width × length 100 mm × 100 mm 100 mm × 100 mm (Face Thickness d 5.0 mm 5.0 mm B) Storage 5.2E+05 Pa 5.2E+05 Pa modulus E′ Thickness 9.6E−06 mm/Pa 9.6E−06 mm/Pa d/Storage modulus E′ Piezo- Line length 70 mm 70 mm electric substrate Maximum First member 0.598 V 0.651 V vibration (Face amplitude A) Second member 0.051 V 0.599 V (Face B) Output ratio 11.7 1.09

Regarding a ratio of storage modulus to thickness ratio for each member, for Example 1 the da/E′a was 5.0×10⁻⁸ mm/Pa, and the db/E′b was 9.6×10⁻⁶ mm/Pa. This means that log(db/E′b)−log(da/E′a)=2.3. However, for Comparative Example 1, both the da/E′a and the db/E′b were 9.6×10⁻⁶ mm/Pa. Thus due to da/E′a=db/E′b, log(db/E′b)−log(da/E′a)=0.

As described above, in Example 1 the relationship da/E′a<db/E′b is satisfied. The log(db/E′b)−log(da/E′a) also lies in the range of from 1 to 10.

The results of sensitivity measurements for Example 1 are as illustrated in FIG. 14A and Table 1. Namely, the maximum vibration amplitude was 0.598 V when the first member 220 was imparted with a shock, and the maximum vibration amplitude was 0.051 V when the second member 222 was imparted with a shock. The signal output did not encounter a significant change for the second member 222, in comparison to that in the first member 220, and this would enable selective detection of just the pressure imparted to the first member 220 alone. Namely, in Example 1, the propagation of shock to the piezoelectric substrate 10 was suppressed in the second member 222. The results for Comparative Example 1 are illustrated in FIG. 14B and Table 1. Namely, the maximum vibration amplitude was 0.651 V when the first member 220 was imparted with a shock, and the maximum vibration amplitude was 0.599 V when the second member 222 was imparted with a shock. There was no significant difference observed between the waveforms for the first member 220 and the second member 222. This means that in the piezoelectric substrate 10, pressure imparted to the first member 220 would not be selectively detectable from shock and vibration imparted to the second member 222. Moreover, taking the ratio of maximum vibration amplitudes as an output ratio, this was 11.7 in Example 1 and was 1.09 in Comparative Example 1, thereby confirming that the output ratio of Example 1 was higher than that of Comparative Example 1.

Example 2

A sensor module 200 for mounting to a bumper of a moving body was produced as Example 2. The piezoelectric substrate 10 employed was the same as that of Example 1. FIG. 15A and FIG. 15B illustrate the configuration of Example 2. As illustrated in FIG. 15A, the sensor module 200 of Example 2 had a cuboidal shape in which the width and length were both 100 mm. The first member 220 was a sheet of rubber having a thickness of 1.6 mm=3.2×10⁷ Pa). The second member 222 was urethane foam having a thickness of 20 mm=5.2×10⁵ Pa). In Example 2, a groove was formed in a flat-spiral shape in a surface of the urethane foam of the second member 222, and the piezoelectric substrate 10 laid along this groove. A double-sided pressure sensitive adhesive tape was stuck to the surface of the second member 222 so as to form a double-sided pressure sensitive adhesive tape layer 245 thereon. The piezoelectric substrate 10 was fixed to the second member 222 using the double-sided pressure sensitive adhesive tape. A rubber sheet serving as the first member 220 was disposed adjacent to the flat-spiral shaped piezoelectric substrate 10. Outer peripheral portions of the first member 220 and the second member 222 were fixed together with an adhesive agent. An adhesive layer 230 was formed by the adhesive agent, so as to form a frame shape avoiding the piezoelectric substrate 10.

In Example 2, the first member 220 corresponds to the press section 20A, and the second member 222 and the double-sided pressure sensitive adhesive tape layer 245 correspond to the base section 20B. The thickness of the double-sided pressure sensitive adhesive tape layer 245 was 0.05 mm, this being a thickness that could be ignored in comparison to the thicknesses of the first member 220 and the second member 222. Due to the physical properties of the first member 220 and the second member 222, the ratio of storage modulus to thickness of each member in Example 2 was da/E′a of 5.0×10⁻⁸ mm/Pa, and a db/E′b of 3.8×10⁻⁵ mm/Pa. The log(db/E′b)−log(da/E′a)=2.9. This means that in Example 2 the relationship da/E′a<db/E′b is satisfied. The value of log(db/E′b)−log(da/E′a) also lies in the range of from 1 to 10.

The results of performing sensitivity measurements on the sensor module 200 of Example 2 were that a signal was output for all locations on the pressure-applied face 21 in the first member 220, and shock was isolated by the second member 222.

The entire content of the disclosure of Japanese Patent Application No. 2016-188601 filed on Sep. 27, 2016 is incorporated by reference in the present specification.

All publications, patent applications and technical standards mentioned in the present specification are incorporated by reference in the present specification to the same extent as if each individual publication, patent application, or technical standard was specifically and individually indicated to be incorporated by reference.

REFERENCE SIGNS LIST

-   10, 10A, 10B Piezoelectric substrate -   12A Inner conductor -   14A First piezoelectric material -   14B Second piezoelectric material -   16 Insulating yarn -   20A Press section -   20B Base section -   21 Pressure-applied face -   100 Piezoelectric substrate attachment structure -   210 Main body -   220 First member -   222 Second member -   230 Adhesive layer -   240 Pressure sensitive adhesive tape -   245 Double-sided pressure sensitive adhesive tape layer -   250 Moving body -   260 Shock absorbing member -   280 Protection body -   290 Contact member 

The invention claimed is:
 1. A piezoelectric substrate attachment structure comprising: a press section pressed by contact; a piezoelectric substrate provided adjacent to the press section; the piezoelectric substrate including an elongate plate-shaped conductor wound around a fiber in one direction and an elongate plate-shaped piezoelectric material helically wound around the conductor in the one direction, the piezoelectric substrate being continuously fixed to the press section along an axial direction of the piezoelectric substrate, and a base section provided adjacent to the piezoelectric substrate on an opposite side from the press section, the piezoelectric substrate attachment structure being configured such that the following relationship Equation (a) is satisfied da/E′a<db/E′b  (a) wherein da is a thickness of the press section in a direction of adjacency to the piezoelectric substrate, E′a is a storage modulus of the press section from dynamic viscoelastic analysis, db is a thickness of the base section in the adjacency direction, and E′b is a storage modulus of the base section from dynamic viscoelastic analysis.
 2. The piezoelectric substrate attachment structure of claim 1, wherein the thickness da is in a range of from 0.005 to 50 mm, and the thickness db is in a range of from 0.005 to 100 mm.
 3. The piezoelectric substrate attachment structure of claim 1, wherein the storage modulus E′a is in a range of from 1×10⁵ to 1×10¹² Pa, and the storage modulus E′b is in a range of from 1×10⁴ to 1×10¹⁰ Pa.
 4. The piezoelectric substrate attachment structure of claim 1, wherein: the piezoelectric material is a body formed from an organic piezoelectric material.
 5. The piezoelectric substrate attachment structure of claim 4, wherein the organic piezoelectric material includes polylactic acid.
 6. The piezoelectric substrate attachment structure of claim 1, wherein: the press section, the piezoelectric substrate, and the base section are arranged in this sequence along a direction of pressure-application to the press section.
 7. The piezoelectric substrate attachment structure of claim 1, wherein: the piezoelectric substrate is provided such that an axial direction of the piezoelectric substrate lies in a direction intersecting a direction of pressure-application.
 8. The piezoelectric substrate attachment structure of claim 1, wherein: axial direction movement of the piezoelectric substrate is restricted with respect to at least one of the press section or the base section.
 9. The piezoelectric substrate attachment structure of claim 1, wherein: the press section is an insulator covering an outer periphery of the piezoelectric substrate adjacent to the base section.
 10. A sensor module comprising the piezoelectric substrate attachment structure of claim
 1. 11. The sensor module of claim 10, comprising a main body configured by an integrated unit of the press section and the base section.
 12. A moving body comprising: a shock absorbing member on at least a moving direction side of the moving body; and the piezoelectric substrate attachment structure of claim 1, the shock absorbing member configuring the base section, and the press section and the piezoelectric substrate of the attachment structure being mounted to the shock absorbing member.
 13. A moving body having the base section of the sensor module according to claim 10 attached to a moving direction side of the moving body.
 14. A protection body comprising: a contact member at a contact portion where the protection body makes external contact; and the piezoelectric substrate attachment structure of claim 1, the contact member configuring the base section, and the press section and the piezoelectric substrate of the attachment structure being mounted to the contact member.
 15. A protection body in which the sensor module of claim 10 is formed so as to conform to a shape of an object to be protected. 